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US 2003/0193387 A1Published application
Multiple-value resistor network
AssigneeNone recorded
InventorHan-ping Chen
Life of this patent
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Abstract
A method and apparatus provides resistor networks with two or more resistance values, which may accommodate different circuit configurations with a common circuit assembly. Also, the present invention provides a packaging method using multiple-value resistor networks as connecting and disconnecting mechanisms for the signal lines on the package.
Drawings
Claims9
A resistor network package comprising:
- (a) a plurality of external contact points;
- (b) a plurality of first sub-packages each with a first resistance value between two external contact points;
- (c) a plurality of second sub-packages each with a second resistance value between two external contact points;
- wherein said first resistance value is different from said second resistance value;
- wherein the difference between said first resistance value and said second resistance value is larger than 50% of the first resistance value.
2 more elements
An electronic circuit assembly comprising:
- (a) a plurality of resistor network packages, at least one of which contains a first sub-package with a first resistance value between two external contact points and a second sub-package with a second resistance value between two external contact points, said second resistance value is different from the first resistance value by at least 50% of the first resistance value.
- (b) a plurality of assembly signal lines;
- (c) a circuit sub-assembly having a plurality of sub-assembly signal lines;
- wherein at least one said sub-package in a resistor network package links one said sub-assembly signal line to one said assembly signal line.
1 more element
An electronic circuit assembly comprising:
- (a) a plurality of resistor network packages, at least one of which contains a first sub-package with a first resistance value between two external contact points and a second sub-package with a second resistance value between two external contact points, said second resistance value is different from the first resistance value by at least 50% of the first resistance value.
- (b) a plurality of assembly signal lines;
- (c) a first circuit sub-assembly having a plurality of first sub-assembly signal lines;
- (d) a second circuit sub-assembly having a plurality of second sub-assembly signal lines;
- wherein at least a first sub-package in a resistor network package links one said first sub-assembly signal line to a first said assembly signal line.
- wherein at least a second sub-package in a resistor network package links one said second sub-assembly signal line to a second said assembly signal line.
3 more elements
Dependencies are inferred from the claim text.