Semiconductor integrated circuit
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsTadayuki Shimizu, Masaki Tsukude, Takafumi Takatsuka
Life of this patent
Estimating the term…
Loading patent…
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsTadayuki Shimizu, Masaki Tsukude, Takafumi Takatsuka
Estimating the term…
The semiconductor integrated circuit incudes an input circuit which receives a signal, an internal circuit which applies a predetermined function to the received signal, and an output circuit which outputs the signal applied with the predetermined function. An external power supply voltage VDD and an IO power supply voltage VDDQ which is lower than the voltage VDD are supplied to the semiconductor integrated circuit. A voltage VIO obtained by decreasing the external power supply voltage VDD is supplied to the input circuit. The IO power supply voltage VDDQ is supplied to the output circuit.
A semiconductor integrated circuit comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Backward citations are indexed for grants only.
Using field effect transistors only: programmable
Modifications for compensating variations of temperature, supply voltage or other physical parameters: in field effect transistor circuits
Pulse technique
Term end not estimated
1. Field of the Invention
The present invention relates to a semiconductor integrated circuit, and in particular to a circuit having an input buffer, an internal circuit and an output buffer, in which a power supply voltage supplied to the internal circuit is different from power supply voltages supplied to the input and output buffers.
2. Related Art
FIG. 1 shows a structural view of semiconductor integrated circuit according to a first embodiment of the present invention.
FIG. 2 is a view showing another structure of the semiconductor integrated circuit of the first embodiment.
FIG. 3 is a structural view of the semiconductor integrated circuit according to a second embodiment of the present invention.
Hereinafter, embodiments of semiconductor integrated circuit according to the present invention will be described in detail with reference to the attached drawings. According to research and analysis, it is found that a threshold of input signal of input circuit varies greatly when data is outputted. Further, it is found that such phenomenon occurs because a power supply of the input circuit is the same as that of the output circuit in spite of a low power supply voltage and thus the input circuit is affected by a noise from the output circuit. Taking such points in consideration, structures shown in the following embodiments are devised.
First Embodiment.
FIG. 1 shows a structure of semiconductor integrated circuit of the present invention. The semiconductor integrated circuit includes an input circuit 11 including an input buffer for receiving a data signal from outside, an internal circuit 15 which carries out a processing corresponding to a predetermined function of the semiconductor integrated circuit and an output circuit 13 including an output buffer for generating from the data signal received from the internal circuit 15 a signal to be outputted to a subsequent circuit. The semiconductor integrated circuit also includes step-down circuits 21 and 23.