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AssigneeCredence Systems Corporation
InventorsJohn Hanson, Jonathan Frank, Dario Meluzzi, Daniel M. Cotton
Estimating the term…
A landing system is provided for accurate placing of collection optics in a microscope. In one example, a solid immersion lens (SIL) is used for light collection, and the landing system is operated to place the SIL in contact with an IC. A proximity sensor is used for determining the SIL's position with respect to the IC. The proximity sensor is attached to a z-motion stage. During the placement procedure, the navigation is performed in steps and at each step the compression of the SIL is measured relative to its uncompressed state. When a measured compression exceeds a preset threshold, a SIL landing is recognized. In one example, after a landing is recognized, a further compression is imparted to the SIL in order to place the SIL in a focusing distance to the objective lens.
A landing system for accurately placing collection optics to inspect a specimen, comprising:
A system for inspection of integrated circuits, comprising:
In a system having a collection optics mounted onto a stage and having a proximity sensor for sensing the distance of the collection optics from the specimen, a method for controlling the landing of the collection optics onto a specimen, comprising the steps of:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
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Using non-ionising electromagnetic radiation, e.g. optical radiation: of integrated circuits
Microscopes: base structure
Measuring electric variables
Optical elements, systems or apparatus
Term end not estimated
1. Field of the Invention
The present invention relates to a system for accurate placement of collection optics in microscopes. This application claims priority from Provisional application Ser. No. 60/371,542, filed Apr. 10, 2002.
2. Description of the Related Art
The invention is described herein with reference to particular embodiments thereof which are exemplified in the drawings. It should be understood, however, that the various embodiments depicted in the drawings are only exemplary and may not limit the invention as defined in the appended claims.
FIGS. 1A-1B are general schematics depicting the major components of a testing and debug system which may be used with the landing system according to embodiments of the invention.
FIG. 2 depicts an embodiment of the landing system according to an embodiment of the invention.
The present invention provides a landing system for a soft touchdown and accurate placing of collection optics of microscopes. The system can be used with various arrangements of collection optics, and is especially beneficial for use in microscopes designed for detection of faint light emissions. An example of such a microscope is depicted in FIGS. 1A and 1B, illustrating an IC test and debug system. Of course, the inventive landing system is suitable for use with other systems; however, for illustration purposes, various embodiments of the inventive landing system will be described with reference to the test and debug system of FIGS. 1A and 1B.
FIGS. 1A and 1B are general schematics depicting the major components of the testing and debug system particularly suitable for timing and other testing of microchips, especially from the backside through the substrate (e.g., flip chips). The system operates in conjunction with a commercially available automated testing equipment 105 (ATE). The ATE generally comprises a controller, such as a preprogrammed computer 181, and a test head 124 which comprises an adapter 125 used to deliver signals generated by the controller 181 to the device under test (DUT) 110 in a manner well known in the art. Specifically, the ATE is used to generate signals that stimulate the DUT to perform various tasks, as designed by the chip designer to check and/or debug the chip. The various signals generated by the controller 181 are delivered to the DUT via the adapter 125. The adapter 125 may include a space transformer, a DUT load board and a DUT socket, in a manner well known in the art.
In the embodiment depicted in FIGS. 1A and 1B, the ATE test head is placed on top of a vibration isolated test bench 115, while the chamber 100 that houses the entire optics, imaging and sensing system, and an X-Y-Z stage 175, is situated below. This provides a tremendous advantage as it allows the system to be used with any type and size of ATE without interference with, or making modification to any of the elements inside chamber 100. Rather, the ATE is used to place the DUT from above, so that it is visible to the optics 120 via opening 185. Stage 175 enables placing of the collecting optics at any locations within the opening 185.