An IC testing apparatus includes a testing board having at least one testing region and a plurality of signal grounds thereon, and at least one inductive magnetic device. The testing apparatus is for generating a new DUT reference ground by connecting the inductive magnetic device with the signal ground of the testing region.
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Claims3
An integrated circuit testing apparatus for generating a new reference ground, comprising:
at least one testing region on said integrated circuit test apparatus, said testing region having a plurality of signal grounds;
and
at least one inductive magnetic device;
and
wherein said new reference ground is created by connecting at least one said inductive magnetic device with said signal ground.
#The present invention relates to the field of integrated circuit testing, and more particularly, to a DUT (device under test) testing apparatus having a digital signal ground, which is connected to at least one inductive magnetic device to generate a new reference ground.
#FIG. 1 is a schematic diagram exemplarily showing the configuration of a prior art testing board.
#FIG. 2 is a diagram depicting arrangement of a testing board according to one preferred embodiment of this invention.
#FIG. 3 is a cross-sectional, schematic view illustrating a testing board structure according to this invention.
Detailed description453 words
#Please refer to FIG. 2. FIG. 2 is a diagram depicting arrangement of a testing board according to one preferred embodiment of this invention. As shown in FIG. 2, a testing region 2 is provided. In accordance with the preferred embodiment, the testing board includes four inductive magnetic devices 3 mounted on the testing board. The testing region 2 is located at the center of the testing board. The testing region 2 has its own digital signal ground (DG) and a reference ground G. The reference ground G is a new reference ground created by connecting the digital signal ground DG of the testing region 2 and these four inductive magnetic devices 3 serially. The inductive magnetic device 3 may be a choking coil, ferrite bead, or the like. The new reference ground is an independent ground or, preferably, a multi-ground.
#FIG. 3 is a cross-sectional, schematic diagram conceptually showing the testing board structure of FIG. 2 according to the present invention. In this embodiment, an exemplary four-layer testing board is demonstrated. Note that this invention is not limited to four-layer testing boards. As shown in FIG. 3, a reference ground digital signal ground DG is disposed on a copper-coating surface within the testing region 2 of the second plate (IN1). On the third plate (IN2), a DUT digital signal ground DG and a DUT reference ground G are disposed on a copper-coating surface within the testing region 2. To generate a new reference ground, the digital signal ground DG is serially connected with at least one inductive magnetic device 3.
#From FIG. 3, an original analog ground of the testing region 2 is replaced with the newly-generated DUT reference ground. Under this configuration, even when the digital signal ground DG of the testing region 2 is interfered by noises, the reference ground will be affected by these noises to a nearly minimum degree because the inductive magnetic device 3 is capable of filtering AC signals, thereby improving testing accuracy.