Method of laser machining materials with minimal thermal loading
AssigneeSiemens Dematic Electronics Assembly Systems, Inc.
InventorsAlexander F. Schreiner, Neal Hofmann
Life of this patent
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Abstract
A method of controlling thermal loading of an electronic component material during ablation thereof provides a first laser light beam 42 at a certain power density and fluence and uses the first laser light beam to remove a portion of a first side 47 of the material 36. A second laser light beam 44 is provided at a certain power density and fluence and the second laser light beam is used to remove a portion of a side 49 of the material opposing the first side thereof substantially simultaneously as the portion of the first side is being removed.
Claims21
A method of controlling thermal loading of an electronic component material during ablation thereof, the method including:
- providing a first laser light beam at a certain power density and fluence and using the first laser light beam to remove a portion of a first side of the material, and
- providing a second laser light beam at a certain power density and fluence and using the second laser light beam to remove a portion of a side of the material opposing the first side thereof substantially simultaneously as the portion of the first side is being removed, thereby controlling thermal loading of the material.
A method of controlling thermal loading of an electronic component material during ablation thereof, the method including:
- directing a laser light beam to remove a portion of the material so as to create a heat affected zone in the material;
- waiting a certain time period to permit the material to cool and to permit the heat affected zone to expand in the material;
- and
- after the waiting step, directing the laser light beam to further remove material in at least a portion of the heat affected zone.
A method of controlling thermal loading of an electronic component material during ablation thereof, the method including:
- directing, along an axis, a first laser light beam to remove a portion of one side of the material thereby creating a first heat affected zone in the material, and simultaneously directing along the axis, a second laser light beam to remove a portion of a side of the material opposing the one side thereof thereby creating a second heat affected zone in the material,
- waiting a certain time period to permit the material to cool and to permit the heat affected zones to expand in the material, and
- after the waiting step, directing the laser light beams to further remove material in at least a portion of the heat affected zones to create a through hole in the material.
A method of controlling thermal loading of an electronic component material during ablation thereof, the method including:
- directing a laser light beam to remove a first area of the material so as to create a first heat affected zone in the material,
- thereafter, directing a laser light beam to remove a second area of a material so as to create a second heat affected zone in the material,
- waiting a certain time period to permit the material to cool and to permit the heat affected zones to expand in the material,
- thereafter, directing the laser light beam to further remove material in the first heat affected zone, and
- thereafter, directing the laser light beam to further remove material in at least a portion of the second heat affected zone.
Dependencies are inferred from the claim text.