Apparatus and method for protecting an electronic circuit
AssigneeVisteon Global Technologies, Inc.
InventorAndrew Glovatsky
Life of this patent
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Abstract
The present invention provides in one embodiment, a system for encapsulating a substrate on a vehicle structure. The system includes the substrate, the vehicle structure and a package substrate. The substrate has a top portion and a bottom portion. The vehicle structure is operatively connected to the bottom portion of the substrate. The package substrate has a plurality of layers, where the package substrate is operatively connected to the top portion of the substrate. The package substrate conforms to a periphery area of the top portion of the substrate.
Claims34
A system for encapsulating a substrate on a vehicle structure, the system comprising:
- the substrate having a top portion and a bottom portion, said bottom portion connected to the vehicle structure;
- and
- a package substrate having a plurality of layers, wherein the package substrate is operatively connected to the top portion of the substrate, wherein the package substrate conforms to a periphery area of the top portion of the substrate.
A system for encapsulating a structure on a vehicle structure, the system comprising:
- the substrate having a top portion and a bottom portion, said bottom portion connected to the vehicle structure;
- and
- a package substrate having at least three layers, wherein the package substrate is operatively connected to the top portion of the substrate, wherein the package substrate conforms to an internal portion of the substrate.
A system for encapsulating a substrate on a vehicle structure, the system comprising:
- the substrate having a top portion and a bottom portion, said bottom portion connected to the vehicle structure;
- and
- a package substrate having at least three layers, wherein the package substrate is operatively connected to the top portion of the substrate, wherein the package substrate conforms to an internal portion and a periphery area of the substrate.
A method for protecting a substrate having a top portion and a bottom portion from electromagnetic charge, the method comprising:
- applying a polymer conformal coating to the substrate;
- connecting the bottom portion of the substrate to a structure;
- and
- placing a conformal film having at least three layers over the top portion of the substrate, wherein the package substrate is operatively connected to the top portion of the substrate, wherein the package substrate conforms to a peripheral area of the top portion of the substrate.
A method for protecting a substrate having a top portion and a bottom portion from electromagnetic charge, the method comprising:
- spraying the substrate with a liquid solution;
- connecting the bottom portion of the substrate to a structure;
- and
- placing a conformal film having at least three layers over the top portion of the substrate, wherein the package substrate operatively connects to the top portions of the substrate, wherein the package substrate conforms to a peripheral area of the top portion of the substrate.
An apparatus comprising:
- a package substrate having at least three layers, wherein the package substrate is operatively connected to a substrate, wherein the package substrate conforms to a periphery area of the substrate.
An apparatus comprising:
- a package substrate having at least three layers, wherein the package substrate is operatively connected to a substrate, wherein the package substrate conforms to an internal portion of the substrate.
Dependencies are inferred from the claim text.