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US 2003/0193095 A1Published application
Optical module equipped with a wiring plate
AssigneeOpnext Japan, Inc.
InventorsHiroyasu Sasaki, Masanobu Okayasu, Hideyuki Kuwano
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AssigneeOpnext Japan, Inc.
InventorsHiroyasu Sasaki, Masanobu Okayasu, Hideyuki Kuwano
Estimating the term…
In an optical module including an optical element and a semiconductor IC for driving it in a case, a metal stem 35 on which an optical element 10 is mounted is provided with a wiring plate 11, a semiconductor IC 30 for electrically driving the optical element 10, and the wiring plate 11 are connected with each other by wires 16, and further the wiring plate 11 and the optical element 10 are connected with each other by the wires 16. The optical communication module having excellent high frequency characteristics is formed that shuts out influence of heat from the semiconductor IC upon the optical element and causes no interference between the semiconductor IC and optical connecting lenses.
An optical module including an optical element and a semiconductor IC for driving the optical element in an identical case,
Dependencies are inferred from the claim text.
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No related US applications are recorded in the indexed filing history.
Backward citations are indexed for grants only.
Packages, e.g. shape, construction, internal or external details: mechanical fixtures for holding or positioning the elements relative to each…
Packages, e.g. shape, construction, internal or external details: for coupling an active element with fibres without intermediate optical…
Optical elements, systems or apparatus
Term end not estimated
1. Field of the Invention
The present invention relates to an optical module. To be more specific, the present invention relates to an optical module including electronic circuit parts such as a semiconductor optical element and a semiconductor IC in one package, and more particularly to an optical communication module used in communication systems.
2. Description of the Related Art
FIG. 1 is a side sectional view showing a configuration of an embodiment of an optical communication module according to the present invention;
FIG. 2 is a top view showing a configuration of another embodiment of the optical communication module according to the present invention;
FIG. 3 is a top view showing a configuration of further another embodiment of the optical communication module according to the present invention;
Hereinafter, embodiments of the present invention will be described using the accompanying drawings.
FIG. 1 is a side sectional view showing a configuration of an embodiment of an optical communication module according to the present invention.
A case 34 of the optical communication module contains a Peltier element 36 on which a metal stem 35 is mounted, and a metal block 31 on which a semiconductor IC 20 for driving the optical element and a substrate 30 are mounted. On the stem 35 is mounted a substrate 12 on which an optical element 10 such as a semiconductor laser, a wiring plate 11, and a thermistor 14 are mounted. A connector 32 and a lead 33 are provided outside the case 34. The substrate 30, semiconductor IC 20, wiring plate 11, optical element 10, thermistor 14, and the like are electrically connected through connecting wires 16 of metal wires or thin metal ribbon.