Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods

A connection element for carrying at least one semiconductor device, comprising:

• a substantially planar substrate including:
• at least one terminal protruding from a surface of said substantially planar substrate;
• and
• at least one die-attach location;
• and
• a solder mask on said surface of said substantially planar substrate, said solder mask including:
• at least one device-securing region positioned over at least a portion of said at least one die-attach location of said substantially planar substrate;
• and
• at least one dam located between said at least one recessed area and said at least one terminal, said at least one dam having a height that at least a distance said at least one terminal protrudes from said surface of said substantially planar substrate.

A semiconductor device assembly, comprising:

• a carrier substrate including:
• a substantially planar substrate;
• at least one die-attach location on a surface of said substantially planar substrate;
• and
• at least one terminal protruding from said surface of said substantially planar substrate;
• a solder mask on said carrier substrate, including:
• at least one device-securing region positioned at least partially over said at least one die-attach location of said carrier substrate;
• and
• at least one dam positioned adjacent to a peripheral edge of said at least one terminal of said carrier substrate;
• and
• at least one semiconductor device secured to said device-securing region of said solder mask with adhesive material, excess adhesive material located between a peripheral edge of said at least one semiconductor device and said at least one dam, a connection surface of said at least one terminal of said carrier substrate substantially uncontaminated by said excess adhesive material.

A method for designing a solder mask to be used on a carrier substrate, comprising:

• configuring at least one device-securing region of the solder mask to be located over at least a portion of a die-attach location of the carrier substrate;
• configuring at least one recessed area laterally adjacent to said at least one device-securing region;
• and
• configuring at least one dam adjacent to said at least one recessed area, opposite from said at least one device-securing region, to be located laterally adjacent to and contact a peripheral edge of a terminal protruding from a surface of the carrier substrate, and to have a have a height at least as great as a height of said at least one device-securing region.