US 2003/0193091 A1Published application

Semiconductor packages with leadframe grid arrays and components and methods for making the same

AssigneeMicron Technology, Inc.

InventorsChan Min Yu, Ser Bok Leng, Low Siu Waf, Chia Yong Poo, Eng Meow Koon

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Abstract

A semiconductor assembly includes a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An electrically conductive compound, such as solder, may be disposed or formed on the exposed lead portions to form a grid array such as a ball grid array (“BGA”) or other similar array-type structure of dielectric conductive elements. The leads may have inner bond ends including a contact pad thermocompressively bonded to a bond pad of the semiconductor chip to enable electrical communication therewith and a lead section with increased flexibility to improve the thermocompressive bond. The inner bond ends may also be wirebonded to the bond pads. Components for and methods of forming semiconductor assemblies are included.

Claims74

Dependent claims

A semiconductor assembly comprising:

a semiconductor chip comprising at least a first bond pad and at least a second bond pad on an active surface thereof;
at least a first plurality of leads extending over said active surface of said semiconductor chips and, said at least a first plurality of leads comprising at least a first lead and at least a second lead originating proximate a first side of said semiconductor chips in a first plane and having substantially similar lengths;
said at least a first lead electrically connected to said at least a first bond pad and comprising at least a first array offset, said at least one array offset comprising a segment of said at least first lead between inner and outer ends thereof that protrudes from said first plane to a second plane;
said at least a second lead electrically connected to said at least a second bond pad and comprising at least a second array offset, said at least a second array offset comprising a segment of said at least second lead between inner and outer ends thereof that protrudes from said first plane to said second plane;
a distinctive molding compound forming a molded package over at least said active surface of said semiconductor chip and portions of said leads extending through an outer surface of said molded package disposed in said second plane such that at least a portion of said first array offset and said second array offset are exposed through said molded package.

2 more elements

A method of forming a semiconductor package comprising:

providing a semiconductor chip comprising a first surface with at least a first electrical contact pad and at least a second electrical contact pad or an active surface thereof;
providing a leadframe comprising at least a first lead and at least a second lead originating at a first side of said leadframe in a first plane and having substantially similar lengths, said at least a first lead comprising at least a first array offset between inner and outer ends thereof comprising a segment of said at least a first lead that protrudes from said first plane to a second plane, and said at least a second lead comprising at least a second array offset between inner and outer ends thereof comprising a segment of said at least second lead that protrudes from said first plane to said second plane;
attaching said leadframes to said active surface of said semiconductor chip;
electrically connecting said at least first lead to said at least a first bond pad and said at least a second pad for said at least a second bond pad;
placing the leadframe and semiconductor chip into a mold cavity with at least a portion of said first array offset and said second array offset and in contact with an interior surface of said mold cavity;
and
introducing a molding compound into said mold cavity to encapsulate said at least a first lead and said at least a second lead and said active surface of said lead semiconductor chip.

4 more elements

Dependencies are inferred from the claim text.