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AssigneeRound Rock Research, LLC
InventorsBrad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
Estimating the term…
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
A system comprising:
An integrated circuit package comprising:
A substrate comprising a first surface and a second surface, the second surface having a plurality of pads, each pad having one or more conductive traces on the second surface extending therefrom and configured to increase the shear strength of the pad as compared to the pad alone.
A method of building an integrated circuit package comprising the acts of:
A system comprising:
An integrated circuit package comprising:
A substrate comprising a first surface and a second surface, the second surface having an array of landpads, the array comprising four corner landpads, each of the four corner landpads having one or more conductive traces extending planarly therefrom and configured to increase the shear strength of the pad.
A substrate comprising a first surface and a second surface, the second surface having an array of landpads and four out-rigger pads, each of the out-rigger pads having one or more conductive traces extending planarly therefrom and configured to increase the shear strength of the pad.
A method of manufacturing an integrated circuit package comprising the acts of:
A method of building an integrated circuit package comprising the acts of:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
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Package configurations: characterised by the relative positions of pads or connectors relative to package parts
The semiconductor body being completely enclosed: forming a chip-scale package [CSP]
Connecting or disconnecting: of bond wires
Bond wires: materials of bond wires
Term end not estimated
1. Field of the Invention
The present invention relates generally to microelectronic packaging and, more particularly, to a method and apparatus for improving laminate performance in a ball grid array (BGA) package.
2. Description of the Related Art
The foregoing and other advantages and features of the invention will become apparent upon reading the following detailed description and upon reference to the drawings in which:
FIG. 1 illustrates a block diagram of an exemplary processor-based device in accordance with the present invention;
FIG. 2 illustrates a plan view of a circuit board having various devices employed thereon;
One or more specific embodiments of the present invention will be described below. In an effort to provide a concise description of these embodiments, not all features of an actual implementation may be described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.
Turning now to the drawings, and referring initially to FIG. 1, a block diagram depicting an exemplary processor-based device, generally designated by the reference numeral 10, is illustrated. The device 10 may be any of a variety of different types, such as a computer, pager, cellular telephone, personal organizer, control circuit, etc. In a typical processor-based device, a signal processor 12, such as a microprocessor, controls many of the functions of the device 10.
The device 10 typically includes a power supply 14. For instance, if the device 10 is portable, the power supply 14 would advantageously include permanent batteries, replaceable batteries, and/or rechargeable batteries. The power supply 14 may also include an A/C adapter, so that the device may be plugged into a wall outlet, for instance. In fact, the power supply 14 may also include a D/C adapter, so that the device 10 may be plugged into a vehicle's cigarette lighter, for instance.