Substrate for light emitting diodes

#The present invention relates to a substrate for a light emitting diode (LED) used in an electronic instrument such as a portable telephone.

#In recent years, it is required that the substrate for the LED has a high heat radiation property, heat-resistant property and high mechanical strength in accordance with the tendencies of a high performance, multifunction, small size of the electronic instrument.

#FIG. 15 is a perspective view showing a conventional substrate for an LED. The substrate comprises a metal base 51 made of copper or aluminum, an insulation layer of prepreg adhered on the metal base 51, circuit patterns 53 and 54 made of copper foil on which gold is plated. An LED 70 is mounted on the circuit pattern 53 and connected to the circuit pattern 54 by a wire 71.

#FIG. 1 is a perspective view of a substrate according to a first embodiment of the present invention;

#FIGS. 2 and 3 are perspective views showing a preparation of metal bases;

#FIGS. 4 through 9 are perspective views showing a method for manufacturing the substrate;

#FIG. 1 is a perspective view of a substrate according to a first embodiment of the present invention.

#The substrate comprises a pair of metal bases 1a and 1b made of copper, each having a cubic shape, a first heat insulation layer 2 of prepreg between the metal bases 1a and 1b, a second heat insulation layer 3 of prepreg adhered to the metal bases 1a and 1b, a pair of circuit patterns 4a and 4b made of copper foil provided on the second insulation layer 3. On the circuit patterns 4a and 4b, electrodes 6a are formed by gold plating, and terminal electrodes 1b are formed on the underside of metal bases. An LED 40 is securely mounted on both the circuit patterns 4a and 4b.

#The LED 40 on the circuit patterns 4a and 4b is connected to the terminal electrodes 6a and 6b by through holes 5 passing through the metal bases 1a and 1b.