Substrate with dam bar structure

#The present invention relates to chip carriers, and more particularly, to a substrate for use in a BGA (ball grid array) semiconductor package.

#BACKGROUND OF THE INVENTION

#A ball grid array (BGA) package is an advanced semiconductor technology characterized by using high-density arrangement of solder balls as input/output (I/O) connections, allowing a chip mounted on a substrate to be electrically connected to an external device by means of the solder balls.

#The present invention can be more fully understood by reading the following detailed description of the preferred embodiments, with reference made to the accompanying drawings, wherein:

#FIG. 1 is a top view of a first embodiment of a substrate of the invention;

#FIG. 2 is a cross-sectional view of the substrate of FIG. 1 cutting along a line 2-2;

#The following description is made with reference to FIGS. 1 to 4 for detailing preferred embodiments of a substrate with a dam bar structure proposed in the present invention. The drawings are made in a simplified manner as to only illustrate components or parts related to the disclosure of this invention; it should be understood that, these components or parts are not drawn in real sizes or numbers, and the substrate of this invention is structurally more complex in practical fabrication. A substrate for use in a BGA (ball grid array) semiconductor package is exemplified hereinafter without setting any restriction to the scope of the invention.

#First Preferred Embodiment

#FIG. 1 illustrates a substrate with a dam bar structure of the invention. As shown in the drawing, a substrate 5 suitably used for a BGA semiconductor package is prepared. The substrate 5 is mainly made of a conventional resin material such as epoxy resin, polyimide resin, BT resin or FR4 resin.