Embedded flat film molding

A packaged integrated circuit sensor device comprising:

• a flat filter layer having opening therethrough;
• an integrated circuit die having a sensing surface, the filter layer in contact with the sensing surface;
• and
• encapsulation material surrounding at least a portion of the integrated circuit die while leaving the sensing surface exposed except for coverage by the filter layer,
• wherein the encapsulation material extends through the openings in the filter layer to contact the integrated circuit die.

A method of packaging an integrated circuit sensor device comprising:

• forming openings within a flat filter layer;
• and
• assembling a mold adapted to receive the filter layer and an integrated circuit die having a sensing surface, the mold maintaining the filter layer in contact with the sensing surface when assembled with the integrated circuit die and the filter layer, the mold defining an enclosure into which material is selectively injected to encapsulate the integrated circuit die while leaving the sensing surface exposed except for coverage by the filter layer,
• wherein the openings within the filter layer are positioned to permit passage of the encapsulating material therethrough during injection of the encapsulating material into the mold.