US 2003/0193071 A1 · Circuit structure for connecting bonding pad and ESD protection circuit

Abstract

A circuit structure for connecting a bonding pad with an electrostatic discharge protection circuit. The circuit structure includes a plurality of conductive layers, a first plurality of first vias, a first conductive line, a plurality of second conductive lines and a plurality of second vias. The conductive layers are parallel layers each at a different height level between the bonding pad and a substrate. The first vias connect the bonding pad electrically with a neighboring conductive layer as well as each neighboring conductive layer. The first conductive line connects electrically with the conductive layer nearest the substrate and the drain terminal of an ESD protection circuit. The second conductive lines are parallel lines each at a different height level between the first conductive line and the bonding pad. Each second conductive line connects electrically with the conductive layer at a corresponding height level. The second vias connect electrically with the first conductive line and the second conductive line adjacent to the first conductive line as well as each neighboring second conductive line.

Claims18

Dependent claims

A circuit structure for connecting a bonding pad with an electrostatic discharge (ESD) protection circuit on a substrate, comprising:

a plurality of conductive layers in parallel and each at a different height level between the bonding pad and the substrate;
a plurality of first vias electrically connected with the bonding pad and the conductive layer next to the bonding pad as well as neighboring conductive layers;
a first conductive line electrically connected with the conductive layer closest to the substrate as well as a drain terminal of the ESD protection circuit;
a plurality of second conductive lines in parallel and each at a different height level between the first conductive line and the bonding pad, wherein each second conductive line connects with one of the conductive layers at the same height level;
and
a plurality of second vias electrically connected with the first conductive line and the second conductive line next to the first conductive line as well as each neighboring second conductive line.

3 more elements

Dependencies are inferred from the claim text.

Circuit structure for connecting bonding pad and ESD protection circuit

Life of this patent

Circuit structure for connecting bonding pad and ESD protection circuit

Life of this patent

Abstract

Claims18