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US 2003/0192938 A1Published application
Printed circuit board and restoration thereof
AssigneeCanon Kabushiki Kaisha
InventorsYukihito Ikeda, Joji Nagahira
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AssigneeCanon Kabushiki Kaisha
InventorsYukihito Ikeda, Joji Nagahira
Estimating the term…
A printed circuit board comprises plural electronic parts, a printed-wiring board for mounting the plural electronic parts mounted thereon, and soldered portions provided on the printed-wiring board, wherein the soldered portion connects electrically the printed-wiring board and the electronic part by solder, and a soldered portion to be restored is assigned according to a failure data derived in a preliminary reliability test of a printed circuit board, and the assigned soldered portion is subjected to re-soldering. A method for restoring a printed circuit board comprises steps: recovering a printed circuit board used in market having plural electronic parts mounted through solder at soldered portions provided on a printed-wiring board, assigning soldered portions to be restored according to a failure data derived in a preliminary reliability test of a same printed circuit board, and carrying out a re-soldering at the assigned soldered portion.
A printed circuit board comprising:
A method for restoring a printed circuit board comprising steps:
A method for restoring a printed circuit board having plural electronic parts mounted through solder at soldered portions, which has been installed in an electronic apparatus, comprising steps:
Dependencies are inferred from the claim text.
No related US applications are recorded in the indexed filing history.
Backward citations are indexed for grants only.
Drawings are temporarily unavailable. Open the PDF at USPTO
Secondary treatment of printed circuits: correcting or repairing of printed circuits
Leadless components: having edge contacts, e.g. leadless chip capacitors, chip carriers
By soldering: lead-in-hole components
Post-manufacturing processes: removing, replacing or disconnecting component; Easily removable component
Term end not estimated
1. Field of the Invention
The present invention relates to recycle of printed circuit boards of electronic apparatuses, in particular to a method of restoring a printed circuit board.
2. Related Background Art
FIG. 1 is a perspective view of a printed circuit board of a first embodiment of the present invention.
FIG. 2 is a sectional view of a soldered portion for mounting a chip resistance on a printed-wiring board.
FIG. 3 is a sectional view of a soldered portion for mounting a connector on a printed-wiring board.
The embodiments of the present invention are described below in detail by reference to drawings.
FIG. 1 is a perspective view of a printed circuit board for an electronic apparatus employed in the restoration method of the present invention. In FIG. 1, the reference numerals denote the members as follows: 1, a printed circuit board; 2, a printed-wiring board made of glass, an epoxy resin, or the like; 3 and 4, respectively a chip resistance mounted on printed-wiring board 2, chip resistance 4 being larger in size than chip resistance 3; and 5, a lead-insertion type connector mounted on printed-wiring board 2.
FIG. 2 is a sectional view illustrating a soldered portion for mounting chip resistance 3 on printed-wiring board 2. Chip resistance 3 is surface-mounted on printed-wiring board 2. The numeral 3a denotes a wiring pattern formed on printed-wiring board 2. The numeral 3b denotes solder. Chip resistance 3 is fixed and connected electrically by solder 3b to wiring pattern 3a on printed-wiring board 2. Chip resistance 4 is mounted onto printed-wiring board 2 in the same manner.