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AssigneeMicron Technology, Inc.
InventorsKarl M. Robinson, David L. Chapek
Estimating the term…
A thermal reflow processing system has a rotatable structure to which articles having a reflowable surface are attached. The structure is coupled to a drive motor which causes the structure to rotate at speeds which generate centripetal forces in excess of that of gravity. The system is equipped with at least one radiant heat source. As the articles are being subjected to a centripetal force, the surface is heated by the radiant heat source.
An apparatus for thermally processing of a portion of a surface of an article comprising:
An apparatus for thermally processing a portion of a surface of an article comprising:
An apparatus for thermally processing a portion of a surface of an article comprising:
A system for thermally processing a portion of a surface of an article comprising:
An apparatus for thermally processing a portion of a surface of an article comprising:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
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Furnaces of a kind not covered by any of groups f27b1/00 -
Furnaces, kilns, ovens or retorts in general
Term end not estimated
1. Field of the Invention
This invention relates to integrated circuit processing and, more particularly, to rapid thermal processing and reflow operations.
2. State of the Art
FIG. 1 is a see-through isometric view of a preferred embodiment of the new rapid thermal processing system with the upper chamber portion removed;
FIG. 2 is a top-plan view of the upper chamber portion;
FIG. 2A is a side elevational view of the upper chamber portion;
The present invention represents a significant advancement in rapid thermal reflow processing technology, and particularly as it relates to the processing of integrated circuits. The present invention, by providing greatly increased gravitational loading on processed wafers, is able to greatly reduce thermal exposure during rapid thermal processing and to achieve better contact via fill, and greater densification and more effective planarization of thermally processed layers.
In order to achieve the aforementioned results, a thermal reflow processing system is designed to have a rapidly-spinning, cylindrically-walled, drum-like chamber with a radiant heat source axially centered therein. Products for which the surface thereof is to be reflowed (e.g., semiconductor wafers) are positioned near the chamber wall with the surface to be reflowed facing the heat source. In the case of circular semiconductor wafers, the wafers are positioned such that the planar surface of each wafer is centered on and perpendicular to a radius of the cylindrical chamber. By performing the reflow operation while the chamber is spinning, high pseudo-gravitational forces can be generated which aid in planarization, void elimination, densification and in the filling of small aspect ratio contact via openings.
Liquid flow is governed by the following equation: