Heat processing device

A device for performing a heat processing on a substrate, comprising:

• a) a holding table which can mount a substrate thereon and which has a heat pipe structure therein;
• b) a heating part which is attached to said holding table to heat said holding table through said heat pipe structure;
• c) a first cooling part which is thermally coupled to working fluid of said heat pipe structure, and which has a cooling structure for cooling said working fluid;
• and
• d) a second cooling part which has a second cooling structure brought into contact with and disposed on a lower face side of said housing, and which cools said holding table by said second cooling structure.

A device for performing a heat processing on a substrate, comprising:

• a) a holding table which includes a housing having therein an inner space serving as a working domain of working fluid in a heat pipe structure and which mounts a substrate on an upper face side of said housing;
• b) a heating part which is attached to said holding table to heat said holding table through said heat pipe structure;
• c) a first cooling part which has a first cooling structure disposed in said inner space and which cools said holding table by said first cooling structure;
• d) a second cooling part which has a second cooling structure brought into contact with and disposed on a lower face side of said housing, and which cools said holding table by said second cooling structure;
• and
• e) a controlling part which controls the cooling state of said first cooling part and the cooling state of said second cooling part.

A device for processing a substrate, comprising:

• a) a thermal unit which includes
• a holding table which includes a housing having therein an inner space serving as a working domain of working fluid in a heat pipe structure and which mounts a substrate on an upper face side of said housing,
• a heating part which is attached to said holding table to heat said holding table through said heat pipe structure, and
• a cooling part which has a cooling structure disposed in said inner space and which cools said holding table by said cooling structure;
• and
• b) a transportation mechanism which transports said substrate to said thermal unit.

A device for processing a substrate, comprising:

• a) a thermal unit which includes
• a holding table which can mount a substrate thereon and which has a heat pipe structure therein,
• a heating part which is attached to said holding table to heat said holding table through said heat pipe structure,
• a first cooling part which is thermally coupled to working fluid of said heat pipe structure, and which has a cooling structure for cooling said working fluid, and a second cooling part which has a second cooling structure brought into contact with and disposed on a lower face side of said housing, and which cools said holding table by said second cooling structure;
• and
• b) a transportation mechanism which transports said substrate to said thermal unit.

A device for processing a substrate, comprising:

• a) a thermal unit which includes
• a holding table which includes a housing having therein an inner space serving as a working domain of working fluid in a heat pipe structure and which mounts a substrate on an upper face side of said housing,
• a heating part which is attached to said holding table to heat said holding table through said heat pipe structure,
• a first cooling part which has a first cooling structure disposed in said inner space and which cools said holding table by said first cooling structure,
• a second cooling part which has a second cooling structure brought into contact with and disposed on a lower face side of said housing, and which cools said holding table by said second cooling structure, and
• a controlling part which controls the cooling state of said first cooling part and the cooling state of said second cooling part;
• and
• b) a transportation mechanism which transports said substrate to said thermal unit.

A method for performing a heat processing on a substrate, comprising the steps of:

• a) mounting a substrate on a holding table which includes a housing having therein an inner space serving as a working domain of working fluid in a heat pipe structure;
• b) heating said working fluid, the heat of which is transferred to said substrate through said heat pipe structure and said holding table, whereby said substrate is heated, by using a heating part attached to said holding table;
• and
• c) cooling said substrate mounted on said holding table by using a cooling structure disposed on said inner space.