Micro-loop heat pipe

#The present invention relates to a MICRO-LOOP HEAT PIPE, under the condition of no additional acting-force, removes the waste heat from the devices needed heat-dissipation to the well heat-dissipating circumstance by flexible contact.

#In the developing trends of lightness, thinness, shortness, and smallness for hi-tech products, the solution for the problem of heat dissipation becomes more and more important.

#In the prior arts, the desktop computer is arranged with a fan in the CPU by applying air to cool it. However, in a limited space, above problem needs another structure to solve the problem of insufficient room for arranging a fan. For example, the heat dissipation of CPU of laptop computer, due to the limitation of space, is different from the fan arranged in the CPU of the desktop computer. In the prior arts for CPU's heat-dissipation of laptop computer, an application of heat-dissipating tube is used. One end of the heat-dissipating tube is a heat-absorbing end that absorbs the waste heat of the CPU. Another end is a heat-dissipating end, of which height is higher than the absorbing end. A working fluid of low boiling point is contained in the heat-dissipating tube. The working fluid is heated and become gas state by the heat-dissipating end of the heat-dissipating tube receiving the dissipated heat from the CPU. The gasified working fluid then floats up to the other cooling end of the heat-dissipating tube. The cooling end is usually arranged in the back portion of the LCD where the ventilation is good, or it is arranged on the machine shell. The gasified working fluid is cooled therein and changed from gas state back to liquid state. The liquidized working fluid is then flowed back to the heat-absorbing end by the operation of gravity and completes a heat-fluid circulation. By this manner of heat-fluid circulation, the CPU's heat is continuously dissipated out to the atmosphere.

#FIG. 1 is an illustration of action principle of the MICRO-LOOP HEAT PIPE of the present invention.

#FIG. 2 is a cross-sectional view of A-A line in FIG. 1.

#The present invention is mainly to provide a MICRO-LOOP HEAT PIPE, of which metal net structure may be designed and manufactured as a wick by the connection technology of micro electric mechanic system (MEMS). It is also possible to make mass production and control the flow field behavior inside the wick. The wick is flexible and its geometric size is variable. The entire system is also a flexible structure and it is formed by the connection technology of the micro electric mechanic system (MEMS). The elements or the devices required by the flexible contact may increase the efficiency of heat transfer, increase the reliability of manufacture, and reduce the cost of manufacture.

#The action principle and structure of the invention are described as following. Please refer to FIG. 1 and FIG. 2, which show a MICRO-LOOP HEAT PIPE of the invention, under the condition of no additional acting-force, removes the waste heat from the devices needed heat-dissipation to the well heat-dissipating circumstance by flexible contact. The MICRO-LOOP HEAT PIPE includes: at least a flexible metal film 1, at least a wick structure by metal net 2, and a working fluid 3. The flexible metal film 1 forms a closed space in which fluids may circulate, and has a heat-absorbing zone 11 and a heat-dissipating zone 12 that both are connected by flow path 13.

#The metal net structure 2 is a flexible structure arranged in the heat-absorbing zone 11, and in which the transferred-into heat may be conducted uniformly. Also, the metal net structure 2 may be firstly constructed as a flat plane net that is connected by metal threads of same or different thread radius in the way of diffusion bonding. Secondly, the flat plane net is connected upwardly by the manner of diffusion bonding to be formed as a three-dimensional net. And,