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US 2003/0192414 A1Published application
Cutting device for bonded wires
AssigneeF & K Delvotec Bondtechnik GmbH
InventorFarhad Farassat
Life of this patent
Estimating the term…
Abstract
Bond-wire cutting device for cutting off the part of a bond wire that extends beyond the bonding contact area after a bonded connection has been produced, with a knife that can be moved with a movement component perpendicular to the surface of a substrate and hence to the bonding contact area, wherein the knife is mounted so as to be yielding with respect to the movement component perpendicular to the substrate surface, so that the force acting on the cutting edge of the knife when the knife encounters the substrate is limited to a prespecified peak value.
Claims12
Bond-wire cutting device (81;
- 91;
- 101) for cutting off the part of a bond wire (14) that extends beyond the bonding contact area (18, 20) after a bonded connection has been produced, with a knife (17;
- 17′;
- 86;
- 96;
- 106) that can be moved with a movement component perpendicular to the surface of a substrate (13) and hence to the bonding contact area,
- characterized in that the knife is mounted so as to be yielding to a limited extent with respect to the movement component perpendicular to the substrate surface, in such a way that the force acting on the cutting edge of the knife when the knife encounters the substrate is limited to a prespecified peak value.
4 more elements
Dependencies are inferred from the claim text.