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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsSatoshi Kadohata, Jun Yamauchi, Yasuhiro Kashiwagi
Estimating the term…
For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3a, 3b, 3c, 3d, 3e and 3f are kept in holes 5 provided in a straight line row in nozzle stocker 4 in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head 1 has to go to a place above the nozzle stocker 4 to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head 1 is required to move only to a place above the next nozzle 3b after returning the used nozzle 3a to a hole 5. Thus the stroke L of transfer head 1 needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.
A method of mounting electronic components on a circuit board by picking up an electronic component supplied through parts feeder with suction nozzle of transfer head which suction nozzle being replaceable with other suitable ones matching the type of electronic component to be mounted, wherein
An apparatus for mounting electronic components onto a circuit board by picking up an electronic component supplied through parts feeder with a suction nozzle of transfer head, comprising
A method of mounting electronic components onto a circuit board by picking up electronic components supplied through parts feeder with a plurality of suction nozzles of transfer head which suction nozzles being replaceable with suitable ones matching the type of electronic components to be mounted, wherein
Dependencies are inferred from the claim text.