Control method of semiconductor memory device and semiconductor memory device
AssigneeFujitsu Limited
InventorsYoshiharu Kato, Satoru Kawamoto
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AssigneeFujitsu Limited
InventorsYoshiharu Kato, Satoru Kawamoto
Estimating the term…
It is intended to provide a control method of a semiconductor memory device and a semiconductor memory device capable of shortening pre-charge operation time that comes after termination of successive data access operation, namely, successive data read/write operation, without causing deterioration of restore voltage to memory cells and delay of initial data access time. An activated word line WL0 is deactivated with appropriate timing that is between time after bit line pairs (BL0 and /BL0, . . . BLN and /BLN) are differentially amplified up to full amplitude voltage level and time where column selecting lines CL0, . . . CLN are selected. That is, deactivation time τA for the word line can be embedded in a period of successive data access operation. Pre-charge operation can be terminated within time that is a sum of deactivation time τAB of a sense amplifier and equalizing time τC of the bit line pairs. Thereby, pre-charge period can be shortened.
A control method of a semiconductor memory device for executing successive access operation, the control method comprising:
A control method of a semiconductor device comprising:
A semiconductor memory device comprising:
Dependencies are inferred from the claim text.
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Read-write [R-W] circuits: bit-line management or control circuits
Arrangements for writing information into, or reading information out from, a digital store: bit line control circuits, e.g. drivers, boosters,…
For memory cells of the field-effect type: timing circuits
Address circuits: word line control circuits, e.g. word line drivers, - boosters, - pull-up, - pull-down, - precharge
Term end not estimated
1. Field of the Invention
Present invention relates to a control method of a semiconductor memory device and the semiconductor memory device having a successive data access operation, and in particular, a control method of a semiconductor memory device and the semiconductor memory device in which a pre-charge operation is required after completion of the successive access operation.
2. Description of the Related Art
FIG. 1 is an operational waveform diagram of successive access operation for illustrating principle of the present invention;
FIG. 2 is a circuit block diagram showing data-input/output path of a semiconductor memory device directed to a first embodiment;
FIG. 3 shows a circuit block diagram of a specific example of pre-charge control section directed to the first embodiment;
FIG. 1 shows an operational waveform diagram of successive access operation for illustrating principle of the present invention. Data of a plurality of bit lines connected to a plurality of memory cells due activation of a word line are set in a plurality of bit line pairs (BL0 and /Bl0, . . . , BLN and /BLN) and differentially amplified by sense amplifiers (not shown) up to voltage level of power source voltage VCC and ground voltage VSS. That is, when voltage level of the plurality of bit lines connected to the plurality of memory cells reach the power source voltage VCC or the ground voltage VSS, data-restore to each of the memory cells terminates and retention of data can be kept.
When voltage level obtained by differential amplification at the bit line pairs (BL0 and /Bl0, . . . , BLN and /BLN) reaches predetermined voltage level, connection between a bit line pair selected by column selecting lines CL0, . . . , CLN and a data line pair (DB and /DB) is started. Voltage level of the data line pair (DB and /DB) is amplitude-limited in voltage. As a center value of amplitude-limited voltage, a voltage value is set to voltage level of (½) VCC. Therefore, when a bit line pair and a data line pair are connected, voltage level of the bit line pair receive voltage interference of the data line pair. For example, voltage level of bit lines BL0, . . . , BLN in high voltage level lowers whereas that of bit lines /BL0, . . . , /BL0 in low voltage level rises. That is, so-called disturb phenomenon occurs.
As to voltage level of the bit line pairs (BL0 and /Bl0, . . . , BLN and /BLN) when connection is started, the voltage level against voltage interference due to disturb phenomenon may be amplification level that can avoid inversion of high-low voltage relation between bit lines. Not necessarily differential amplified up to full amplification level. In FIG. 1, a column selecting line CLO is driven in a form of pulse when differential amplification level of the bit line pair (BL0 and /BL0) reaches predetermined voltage so as to secure high-speed initial access for successive access operation.