Electron donors, electron acceptors and adhesion promoters containing disulfide

A composition comprising a compound having the structure

• (E)m—Z—X—R—S—S—R′—X′—Z′—(E′)n
• in which
• m and n are an integer of 0 to 500, provided that m and n cannot both be 0;
• E and E′ are an electron donor or an electron acceptor;
• R and R′ are a direct bond, a linear or branched alkyl or alkenyl group, or a cyclic alkyl or alkenyl group, or an aromatic group;
• Z and Z′ are any organic moiety;
• and
• X and X′ are a direct bond, an alkyl group, or a functionality selected from the group consisting of.
• 22
• the composition further comprising optionally a curing agent and optionally a filler.

A compound having the structure

• 23
• in which
• m and n are 0 to 500, provided both m and n are not 0;
• R1 and R6 are a methyl or ethyl group;
• R2, R3, R4, and R5 are a vinyl group, an aromatic group, or a linear or branched alkyl group;
• x and y are 0 or 1;
• R and R′ are a direct bond, a linear or branched alkyl or alkenyl group, or a cyclic alkyl or alkenyl group, or an aromatic group;
• Z and Z′ are any organic moiety;
• and
• X and X′ are a direct bond, an alkyl group, or a functionality selected from the group consisting of
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A composition comprising a compound having the structure

• 27
• in which
• m and n are 0 to 500, provided both m and n are not 0;
• R1 and R6 are a methyl or ethyl group;
• R2, R3, R4, and R5 are a vinyl group, an aromatic group, or a linear or branched alkyl group;
• x and y are 0 or 1;
• R and R′ are a direct bond, a linear or branched alkyl or alkenyl group, or a cyclic alkyl or alkenyl group, or an aromatic group;
• Z and Z′ are any organic moiety;
• and
• X and X′ are a direct bond, an alkyl group, or a functionality selected from the group consisting of
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• the composition further comprising optionally a curing agent and optionally a filler.