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AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, David J. Corisis, Salman Akram
Estimating the term…
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
A module for a bare semiconductor die having a plurality of bond pads on a surface thereof, said module comprising:
A module for contact with a portion of a semiconductor die, said semiconductor die having a plurality of bond pads on at least one surface thereof adjacent an edge of said semiconductor die, said module comprising:
A plate for abutting another plate for forming a socket for connecting a bare semiconductor die to a substrate comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Backward citations are indexed for grants only.
Package configurations
Coupling devices: coupling device supported only by cooperation with PCB
Coupling with the edge of the rigid printed circuits or like structures: cooperating directly with the edge of the rigid printed circuits
Contact pressure producing means, contacts activated after insertion of printed circuits or like structures: activated by shape memory material
Term end not estimated
1. Field of the Invention
This invention relates generally to methods and apparatus for electrically connecting semiconductor devices to circuit boards. More particularly, the invention relates to a socket into which one or more bare semiconductor die may be inserted for connection to a circuit board without wire bonding of the contact pads of the semiconductor die.
2. State of the Art
The invention is illustrated in the following figures, wherein the elements are not necessarily shown to scale:
FIG. 1 is a perspective view of a modular socket of the invention;
FIG. 2 is a perspective view of partially assembled modules of a modular socket of the invention;
As depicted in drawing FIG. 1, a modular bare die socket 10 of the invention comprises a plurality of modules 12A, 12B and 12C formed of plates 14A, 14B, 14C, and 14D which are stacked perpendicular to a substrate 16. A bare (unpackaged) semiconductor die 18 with conductive bond pads (not visible) near one edge on a major surface 20 thereof, e.g. the “active surface” may be inserted as shown into a die slot 22 and have its bond pads interconnected to conductive traces (not visible) on the surface 24 of the substrate 16.
The internal structures of plates 14C and 14D are depicted in drawing FIG. 2. Each of the plates 14A, 14B, 14C and 14D has a first side 26 and an opposing second side 28. The plates have first ends 30 having die slots 22, and second ends 32 having lead slots 44 through which lead tapes pass.
In these figures, the first side 26 is taken as the left side of each plate and the second side 28 is taken as the right side. The regular plates 14A, 14B and 14C have structure on both sides 26, 28 and may be the exclusive plates of the socket 10. The structure provides for accommodating bare semiconductor dice 18 of a particular size, number and spacing of bond pads, etc. and for electrically interconnecting the semiconductor dice 18 to a substrate 16. Typically, all regular plates 14A, 14B, 14C of a bare die socket 10 are identical but in some cases may differ to accommodate semiconductor dice of different size, bond pad configuration, etc. within different modules 12A, 12B, 12C, etc. of a socket.