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US 2003/0190803 A1Published application
System and method for analog replication of microdevices having a desired surface contour
AssigneeMems Optical, Inc.
InventorsJohn S. Harchanko, Michele Banish
Life of this patent
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Abstract
A master wafer is replicated by creating a mold by plating a nickel electroform on a surface of a silicon wafer. Thereafter, a child wafer is prepared with a layer of photoresist or similar material that is compatible with plasma-etching techniques. Thereafter, the mold shape is transferred to the photoresist through compression molding, thereafter the child wafer is etched.
Claims11
A method of making an analog replica of a master wafer, comprising:
- creating a mold by electroforming a layer of material on the surface of the master;
- preparing a child wafer with a layer of photoresist;
- transferring the mold shape to the photoresist;
- separating the mold from the child wafer;
- and
- etching the child wafer.
3 more elements
Dependencies are inferred from the claim text.