US 2003/0190776 A1 · Module and method of making same

Abstract

A module bonded together at a microplatform and an improved method for making the module are provided. The method includes providing a micromechanical device including a first substrate, the microplatform, a first plurality of bonding sites on the microplatform, a micromechanical structure fabricated and supported on the microplatform and a support structure to suspend the microplatform above the first substrate. The method further includes providing a transistor circuit wafer including a second plurality of bonding sites thereon and integrated BiCMOS transistor circuits. The first and second plurality of bonding sites are aligned and compression bonded so that the microplatform is both electrically and mechanically coupled to the second substrate to form the module. The platform carrier wafer can be torn off, leaving bonded platforms behind on the substrate wafer. This allows small form factor merging of the two different technologies.

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Claims32

Dependent claims

A method for making a module, the method comprising:

a) providing a device including a first substrate, a microplatform, at least one bonding site on the microplatform, a structure fabricated and supported on the microplatform and a support structure to suspend the microplatform above the first substrate;
b) providing a second substrate including at least one circuit bonding site thereon and a circuit;
c) aligning the at least one microplatform bonding site with the at least one circuit bonding site;
and
d) bonding the at least one microplatform bonding site to the at least one circuit bonding site so that the microplatform is bonded to the second substrate at the at least one bond.

2 more elements

Dependencies are inferred from the claim text.

Module and method of making same

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