Pressure transducer with composite diaphragm
AssigneeHoneywell International Inc.
InventorsMichael J. Haji-Sheikh, Gilberto Morales
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AssigneeHoneywell International Inc.
InventorsMichael J. Haji-Sheikh, Gilberto Morales
Estimating the term…
A method of forming a composite diaphragm for a pressure transducer is disclosed. The method comprises providing a substrate layer having a first conductivity type and a first surface. Positive implants are deposited in the first surface of the substrate layer, and an epitaxial layer is grown on the first surface of the substrate layer so that the positive implants form positive diffusions in the epitaxial layer. An oxide pattern is formed on the epitaxial layer, and a top layer is deposited over the epitaxial layer and oxide pattern. The substrate layer and positive diffusions of the epitaxial layer are then etched to form the composite diaphragm. The positive diffusions can be patterned so that the resulting etched structure has improved diaphragm performance characteristics. For example, the remaining pattern can include a plurality of bosses and interconnecting battens so that the diaphragm has a relatively high burst pressure and a high output signal with improved linearity at low pressures.
A method of forming a composite diaphragm for a pressure device, the method comprising the steps of:
A composite diaphragm for use in a pressure device, the diaphragm comprising:
A silicon based diaphragm for a piezoresistor capable of producing a usable, substantially linear output signal at less than 5 inches of H2O of input pressure.
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
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Transmitting or indicating the displacement of flexible diaphragms: constructional details associated with semiconductive diaphragm sensors, e.g.…
Of piezoresistive elements: bonded on a diaphragm
For defining out-of-plane movement of the mass: the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to…
Measuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure
Term end not estimated
The present invention generally relates to pressure transducers and, more particularly, to the diaphragm portions of such transducers.
Pressure transducers that use piezoresistors are well known in the art. Generally, such transducers are formed with a silicon substrate and an epitaxial layer, which is grown on the substrate. A portion of the substrate is removed, leaving a thin, flexible diaphragm portion. The piezoresistors are located in the diaphragm portion to form a pressure transducer.
In operation, at least one surface of the diaphragm is exposed to a process pressure. The diaphragm deflects according to the magnitude of the pressure, and this deflection bends the attached piezoresistors. Bending of the diaphragm creates changes in the resistance value of the piezoresistors, which is reflected as a change in the output voltage signal of a resistive bridge formed at least partially by the piezoresistors.
The accompanying figures, in which like reference numerals refer to identical or functionally-similar elements throughout the separate views and which are incorporated in and form part of the specification, further illustrate the present invention and, together with the detailed description of the invention, serve to explain the principles of the present invention.
FIG. 1 is a bottom view of a diaphragm portion of the pressure transducer illustrating a preferred boss and batten structure.
FIGS. 2A-2G illustrate various steps during the fabrication of the pressure transducer.
It should be understood that the drawings are not necessarily to scale and that the embodiments are illustrated using graphic symbols, phantom lines, diagrammatic representations and fragmentary views. In certain instances, details which are not necessary for an understanding of the present invention or which render other details difficult to perceive may have been omitted. It should be understood, of course, that the invention is not necessarily limited to the particular embodiments illustrated herein.
Referring initially to FIG. 1, a bottom view of a diaphragm 10 for a pressure transducer is shown. The diaphragm 10 includes a layer 12 of first diaphragm material formed in a solid square having a length “L” on each side. A second, patterned layer 14 of diaphragm material is attached to the first layer 12. As illustrated in FIG. 1, the second layer 14 comprises four bosses 16 interconnected by four battens 18. While the boss and batten structure shown in FIG. 1 is preferred, it will be appreciated that a variety of different patterns can be formed in accordance with the present invention. Piezoresistors 19 are attached to the second layer 14 at the base of each boss 16.
To form the pressure transducer diaphragm 10 shown in FIG. 1, the steps depicted in FIGS. 2A-2G are followed. FIG. 2A shows the formation of a substrate 20 having a top surface 22 and a bottom surface 24. The substrate 20 can be formed in a variety of known manners and can comprise any one of a variety of known substrate materials. In the preferred embodiment, the substrate comprises single crystal silicon doped with a p-type material.