Maskless photolithography for etching and deposition
AssigneeUniversity of South Florida
InventorDavid P. Fries
Life of this patent
Estimating the term…
Loading patent…
AssigneeUniversity of South Florida
InventorDavid P. Fries
Estimating the term…
The present invention relates to maskless photolithography using a patterned light generator for creating 2-D and 3-D patterns on objects using etching and deposition techniques. In an embodiment, the patterned light generator uses a micromirror array to direct pattern light on a target object. In an alternate embodiment, the patterned light generator uses a plasma display device to generate and direct patterned light onto a target object. Specifically, the invention provides a maskless photolithography system and method for photo stimulated etching of objects in a liquid solution, patterning glass, and photoselective metal deposition. For photo stimulated etching of objects in a liquid solution, the invention provides a system and method for immersing a substrate in an etchant solution, exposing the immersed substrate to patterned light, and etching the substrate according to the pattern of incident light. For patterning photoreactive glass, the invention provides a system and method for exposing photosensitive or photochromic glass, and washing the target glass with rinse and acid etchant solutions. For photoselective metal deposition, the invention provides a system and method for coating and rinsing a substrate prior to exposure exposing the substrate to a patterned light generator to activate areas corresponding to the incident light pattern, and plating the substrate in the area activated by the light after exposure. By providing a maskless pattern generator, the invention advantageously eliminates the problems associated with using masks for photo stimulated etching, patterning glass, and photoselective metal deposition.
A maskless photolithography system for photo stimulated etching of substrates in a liquid solution comprising:
A maskless photolithography system for patterning of photoreactive glass comprising:
A maskless photolithography system for photoselective metal deposition on a substrate comprising:
A method for maskless photolithography for photo stimulated etching of a substrate in a liquid solution comprising:
A method for maskless photolithography for patterning of photoreactive glass comprising:
A method for maskless photolithography for photoselective metal deposition on a substrate comprising:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
Backward citations are indexed for grants only.
Drawings are temporarily unavailable. Open the PDF at USPTO
Photosensitive materials: providing an etching agent upon exposure
Exposure; Apparatus therefor: with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film…
In the presence of a fluid, e.g. immersion; using fluid cooling means: with the production of a chemical active agent from a fluid, e.g. an…
Exposure; Apparatus therefor: exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing…
Term end not estimated
The present invention relates to photolithography systems and methods, specifically, to maskless photolithography devices and methods for creating 2-D and 3-D patterns on objects using etching and deposition techniques.
Photolithography systems are known in the art that direct light beams onto a photosensitive surface covered by a mask, etching a desired pattern on the substrate corresponding to the void areas of the mask. Maskless photolithography systems are also known in the art as described in Singh-Gasson, Sangeet et al., Nature Biotechnology 17, 974-78, 1999. The system described in this article uses an off-axis light source coupled with a digital micromirror array to fabricate DNA chips containing probes for genes or other solid phase combinatorial chemistry to be performed in high-density microarrays.
A number of patents also exist which relate to maskless photolithography systems, including U.S. Pat. Nos. 5,870,176; 6,060,224; 6,177,980; and 6,251,550; all of which are incorporated herein by reference. While maskless photolithography systems disclosed in the art are directed to DNA chip and semiconductor manufacture, these prior art systems and methods notably lack reference to other applications lending themselves to maskless photolithography techniques.
In order that the manner in which the above recited and other advantages and objects of the invention are obtained, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments thereof, which are illustrated in the appended drawings. Understanding that these drawings depict only typical embodiments of the invention and are not therefore to be considered to be limiting of its scope, the invention will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:
FIG. 1A illustrates a maskless photolithography system.
FIG. 1B illustrates a maskless photolithography system using a plasma display.
It should be understood that in certain situations for reasons of computational efficiency or ease of maintenance, the ordering and relationships of the blocks of the illustrated flow charts could be rearranged or re-associated by one skilled in the art. While the present invention will be described with reference to the details of the embodiments of the invention shown in the drawings, these details are not intended to limit the scope of the invention.
Reference will now be made in detail to the embodiments consistent with the invention, examples of which are illustrated in the accompanying drawings. First, briefly, the invention is a system and method to create two dimensional and three dimensional structures using a maskless photolithography system that is directly reconfigurable and does not require masks, templates or stencils to create each of the planes or layers on a multi layer two-dimensional or three-dimensional structure. Specifically, the invention provides a system and method for photo-stimulated etching of objects in a liquid solution, patterning photosensitive and photochromic glass, and photoselective metal deposition.
The invention uses a patterned light generator to create a patterned light beam corresponding to a desired mask pattern. Specifically, the invention uses a micromirror array comprising up to several million elements to modulate light onto a substrate that has photoreactive or photoresist compounds applied to the exposed surface. The desired pattern is designed and stored using conventional computer aided drawing techniques and is used to control the positioning of the individual mirrors in the micromirror array to reflect the corresponding desired pattern. Light impinging on the array is reflected to or directed away from the substrate to create light and dark spots on the substrate according to the desired pattern. In addition, an alignment fixture for mounting of the substrate allows the substrate to be moved in three dimensions, providing alignment in two, coplanar dimensions and the capability to produce three dimensional structures by aligning the substrate in a third dimension perpendicular to the two coplanar dimensions.