Dynamic use of process temperature
AssigneeLSI Logic Corporation
InventorAlfred A. Badowski
Life of this patent
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Abstract
A process for reacting a gaseous species with a substrate includes placing the substrate in a space, heating the space, introducing the gaseous species into the space, and cooling the space. Introducing the gaseous species into the space includes introducing the gaseous species into the space before the substrate reaches a steady state temperature and/or reacting the gaseous species with the substrate includes reacting the gaseous species with the substrate while cooling the space.
Claims20
In a process for reacting a first gaseous species with a substrate, the process including placing the substrate in a space, heating the space to a first temperature, introducing the first gaseous species into the space, and cooling the space from the first temperature, at least one of:
- (1) introducing the first gaseous species into the space before the substrate reaches the first temperature and (2) reacting the first gaseous species with the substrate while cooling the space.
A process for reacting a first gaseous species with a substrate having a central region and an edge region, the process including placing the substrate in a space, heating the space to a first temperature, introducing the first gaseous species into the space, and cooling the space from the first temperature, wherein at least one of:
- (1) introducing the first gaseous species into the space includes introducing the first gaseous species into the space before the temperatures of the central region and the edge region are approximately uniform and (2) reacting the first gaseous species with the substrate while cooling the space so that the central region and the edge region of the substrate are approximately uniformly reacted with the gaseous species.
A reacted substrate made by placing the substrate in a space, heating the space to a first temperature, introducing a first gaseous,species into the space, and cooling the space from the first temperature, wherein at least one of:
- (1) introducing the first gaseous species into the space includes introducing the first gaseous species into the space before the substrate reaches the first temperature and (2) cooling the space from the first temperature includes reacting the first gaseous species with the substrate while cooling the space.
Dependencies are inferred from the claim text.