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US 2003/0190479 A1Published application
Thermosetting resin compositions comprising epoxy resins, adhesion promoters and curatives based on the combination of nitrogen compounds and transition metal complexes
AssigneeHenkel Loctite Corporation
InventorMark M. Konarski
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Abstract
This invention relates to thermosetting resin compositions useful as underfill sealants for mounting to a circuit board semiconductor device packages, which have a semiconductor chip on a carrier substrate. Reaction products of these compositions demonstrate improved adhesion after exposure to elevated temperature conditions, improved resistance to moisture absorption and improved resistance to stress cracking.
Claims21
A thermosetting resin composition, said composition comprising:
- (a) an epoxy resin component;
- (b) an adhesion promoter component having at least two secondary amine functional groups;. and
- (c) a curative based on the combination of a nitrogen-containing compound and a transition metal complex.
Dependencies are inferred from the claim text.