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US 2003/0190477 A1Published application
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
AssigneeIntel Corporation
InventorsSong-Hua Shi, Lejun Wang, Tian-An Chen
Life of this patent
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Abstract
Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula: 1
Claims30
An electronic assembly, comprising:
- a substrate;
- a film adhered to an upper surface of the substrate, the film including a polybenzoxazine polymer;
- and
- an electronic die adhered to an upper surface of the film.
1 more element
A method of constructing an electronic assembly, comprising:
- adhering an electronic die to a substrate with a film including polybenzoxazine.
A method of constructing an electronic assembly, comprising:
- locating a film between a substrate and an electronic die;
- and
- curing the film by first heating the film and then allowing the film to cool, the film having less than 0.2% shrinkage during curing.
Dependencies are inferred from the claim text.