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AssigneeNone recorded
InventorsKatsuji Nakaba, Toshihiro Nakajima, Takeshi Sato, Osamu Oka
Estimating the term…
An adhesive sheet for producing semiconductor devices, such as QFNs, can prevent the generation both of wire-bonding defects and mold flashes, and can thereby prevent the production of defective semiconductor devices. The present invention provides an adhesive sheet for producing semiconductor devices which is detachably attached to a lead frame and which comprises a heat resistant substrate and an adhesive layer which is arranged on one surface of the heat resistant substrate, wherein the adhesive layer contains, a thermosetting resin component (a) and a thermoplastic resin component (b); and the weight ratio of the component (a)/the component (b) is 0.3 to 3.
An adhesive sheet for producing semiconductor devices which is detachably attached to a lead frame and which comprises a heat resistant substrate and an adhesive layer which is arranged on one surface of the heat resistant substrate,
Dependencies are inferred from the claim text.
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No related US applications are recorded in the indexed filing history.
Backward citations are indexed for grants only.
Comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
Interconnection of layers: at least one layer having inter-reactive properties
Manufacture or treatment: batch processes
Compression bonding, e.g. thermocompression bonding: ultrasonic bonding, e.g. thermosonic bonding
Term end not estimated
1. Field of the Invention
The present invention relates to an adhesive sheet which is detachably attached to a lead frame and which is used for producing semiconductor devices, such as quad flat non-leaded type semiconductor packages.
2. Description of the Related Art
FIG. 1 is a plane view showing a lead frame which are suitably used for producing QFNs using the adhesive sheet of the present invention.
FIGS. 2A to 2F show steps for producing QFNs using the adhesive sheet of the present invention.
Below, the adhesive sheet for producing semiconductor devices of the present invention will be explained in detailed.
The adhesive sheet of the present invention comprises a heat resistant substrate and an adhesive layer which is arranged on one surface of the heat resistant substrate and which contains a thermosetting resin component (a) and a thermoplastic resin component (b).
As the heat resistant substrate, a heat resistant film, a metal foil, and the like can be used.