US 2003/0190446 A1 · Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer

Abstract

Disclosed is an assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising: (a) a holding block; (b) a semiconductor wafer; and (c) an aqueous adhesive composition interposed between the holding block and the semiconductor wafer. Also disclosed is a process for manufacturing a semiconductor wafer, comprising the steps of: (a) providing a holding block; (b) providing a semiconductor wafer; (c) coating either the holding block or one side of the semiconductor wafer with the foregoing aqueous adhesive composition; (d) contacting either one side of the semiconductor wafer to the coated holding block or the coated side of the semiconductor wafer to the holding block, such that the semiconductor wafer adheres to the coated holding block; (e) polishing the other side of the semiconductor wafer; and (f) removing the semiconductor wafer from the coated holding block.

Claims37

Dependent claims

An assembly system for stationing a semiconductor wafer for processing comprising:

(a) a holding block;
(b) a semiconductor wafer;
and
(c) an aqueous adhesive composition interposed between the holding block and the semiconductor wafer, the adhesive composition comprising:
water;
at least one release agent selected from the group consisting of polyethylene glycols, fluorine-free surfactants selected from anionic, cationic, and nonionic surfactants, fluorine-containing surfactants selected from anionic, cationic and nonionic fluorosurfactants, and silicone polymers;
and at least one water-soluble or water-dispersible resin selected from the group consisting of unsubstituted or substituted (meth)acrylic acid containing polymers, unsubstituted or substituted (meth)acrylate containing polymers, unsubstituted or substituted vinyl ester containing polymers, unsubstituted or substituted vinyl aromatic containing polymers, rosin-modified maleic resins, novolak resins, and polymers represented by the formula
10
wherein each R1, R2, and R3 independently is hydrogen or methyl;
R is a hydrocarbyl group of 1 to 4 carbon atoms;
each R4 and R5 independently is hydrogen or a hydrocarbyl group of 1 to 4 carbon atoms;
R6 is hydrocarbyl group of 1 to 20 carbon atoms;
w, x, y, and z independently are a number from 1 to 100.

10 more elements

A process for manufacturing a semiconductor wafer, comprising the steps of:

(a) providing a holding block;
(b) providing a semiconductor wafer;
(c) coating one side of the holding block with an aqueous adhesive composition, the aqueous adhesive composition comprising water;
at least one release agent selected from the group consisting of polyethylene glycols, fluorine-free surfactants selected from anionic, cationic, and nonionic surfactants, fluorine-containing surfactants selected from anionic, cationic and nonionic fluorosurfactants, and silicone polymers;
and at least one water-soluble or water-dispersible resin selected from the group consisting of unsubstituted or substituted (meth)acrylic acid containing polymers, unsubstituted or substituted (meth)acrylate containing polymers, unsubstituted or substituted vinyl ester containing polymers, unsubstituted or substituted vinyl aromatic containing polymers, rosin-modified maleic resins, novolak resins, and polymers represented by the formula
13
wherein each R1, R2, and R3 independently is hydrogen or methyl;
R is a hydrocarbyl group of 1 to 4 carbon atoms;
each R4 and R5 independently is hydrogen or a hydrocarbyl group of 1 to 4 carbon atoms;
R6 is hydrocarbyl group of 1 to 20 carbon atoms;
w, x, y, and z independently are a number from 1 to 100;
(d) contacting one side of the semiconductor wafer to the coated side of the holding block, such that the semiconductor wafer adheres to the coated holding block;
(e) polishing the other side of the semiconductor wafer;
and
(f) removing the semiconductor wafer from the coated holding block.

12 more elements

A process for manufacturing a semiconductor wafer, comprising the steps of:

(a) providing a holding block;
(b) providing a semiconductor wafer;
(c) coating one side of the semiconductor wafer with an aqueous adhesive composition, the aqueous adhesive composition comprising water;
at least one release agent selected from the group consisting of polyethylene glycols, fluorine-free surfactants selected from anionic, cationic, and nonionic surfactants, fluorine-containing surfactants selected from anionic, cationic and nonionic fluorosurfactants, and silicone polymers;
and at least one water-soluble or water-dispersible resin selected from the group consisting of unsubstituted or substituted (meth)acrylic acid containing polymers, unsubstituted or substituted (meth)acrylate containing polymers, unsubstituted or substituted vinyl ester containing polymers, unsubstituted or substituted vinyl aromatic containing polymers, rosin-modified maleic resins, novolak resins, and polymers represented by the formula
14
wherein each R1, R2, and R3 independently is hydrogen or methyl;
R is a hydrocarbyl group of 1 to 4 carbon atoms;
each R4 and R5 independently is hydrogen or a hydrocarbyl group of 1 to 4 carbon atoms;
R6 is hydrocarbyl group of 1 to 20 carbon atoms;
w, x, y, and z independently are a number from 1 to 100;
(d) contacting the coated side of the semiconductor wafer to the holding block such that the semiconductor wafer adheres to the coated holding block;
(e) polishing the other uncoated side of the semiconductor wafer;
and
(f) removing the semiconductor wafer from the coated holding block.

12 more elements

Dependencies are inferred from the claim text.

Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer

Life of this patent

Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer

Life of this patent

Abstract

Claims37