US 2003/0190220 A1 · Substrate transfer shuttle

Abstract

The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is moveable along a linear path defined by guide rollers between one position in the first chamber and another position in the second chamber. In this way, the substrate may be transferred, in both a forward and a reverse direction, between the first chamber and the second chamber. The substrate transfer shuttle is structured so that a substrate may be removed therefrom by moving a support in one of the chambers from a lowered position to an intermediate position, after which the substrate transfer shuttle may be removed from the chamber.

Drawings

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Drawings

Claims59

Dependent claims

A system for processing a substrate, comprising:

a first chamber;
a second chamber coupled to the first chamber and configured to perform a process on a substrate;
a valve to selectively seal the first chamber from the second chamber when closed and to permit transfer of the substrate between the first chamber and the second chamber through the valve when open;
and
a substrate transfer shuttle moveable along a linear path between one position in the first chamber and another position in the second chamber to transfer the substrate between the first chamber and the second chamber.

2 more elements

An apparatus for processing a substrate, comprising:

a load lock chamber for introduction of the substrate;
a processing chamber coupled to the load lock chamber and configured to perform a process on the substrate, said processing chamber having a susceptor for supporting the substrate during the process, the susceptor movable between lowered, intermediate, and raised positions;
a valve to selectively seal the load lock chamber from the processing chamber when closed and to permit transfer of the substrate between the load lock chamber and the processing chamber through the valve when open;
and
a substrate transfer shuttle moveable along a shuttle path between one position in the load lock chamber and another position in the processing chamber to transfer the substrate between the load lock chamber and the processing chamber, the substrate transfer shuttle configured and arranged so that when in said another position, the substrate may be removed from the substrate transfer shuttle by moving the susceptor from the lowered position to the intermediate position, after which the substrate transfer shuttle may be removed from the processing chamber.

2 more elements

An apparatus for performing a process on a substrate, comprising:

a load lock chamber for introduction of the substrate;
a first processing chamber coupled to the load lock chamber and configured to perform a process on the substrate, the first processing chamber including a first susceptor to support the substrate during performance of the process and the first susceptor being movable between lowered, intermediate, and raised positions;
a valve to selectively seal the load lock chamber from the first processing chamber when closed and to permit transfer of the substrate between the load lock chamber and the first processing chamber when open;
a substrate transfer shuttle moveable along a linear shuttle path between one position in the load lock chamber and a second position in the first processing chamber to transfer the substrate between the load lock chamber and the first processing chamber, the substrate transfer shuttle configured and arranged so that when in said second position, the substrate may be removed from the substrate transfer shuttle by moving the susceptor from the lowered position to the intermediate position, after which the substrate transfer shuttle may be removed from the processing chamber;
a second processing chamber coupled to the first processing chamber and configured to perform a process on the substrate, the second processing chamber including a second susceptor to support the substrate during performance of the process and the second susceptor being movable between lowered, intermediate, and raised positions;
a second valve to selectively seal the second processing chamber from the first processing chamber when closed and to permit transfer of the substrate between the second processing chamber and the first processing chamber when open;
and
wherein the substrate transfer shuttle is further moveable along a linear shuttle path between the second position and a third position in the second processing chamber to transfer a substrate between the first processing chamber and the second processing chamber, the substrate transfer shuttle configured and arranged so that a substrate thereon in the third position may be removed by moving the susceptor of the second processing chamber from the lowered position to the intermediate position, after which the substrate transfer shuttle may be withdrawn from the second processing chamber.

5 more elements

An apparatus for performing a process on a substrate, comprising:

a first load lock chamber;
a first load lock valve to selectively seal the first load lock chamber from the first chamber when closed and to permit transfer of the substrate through the first load lock valve when open;
a first chamber coupled to said first load lock chamber and having a mechanism to support the substrate therein, the mechanism movable between retracted and extended positions;
a second chamber coupled to the first chamber and having a mechanism to support the substrate therein, the mechanism movable between retracted and extended positions;
a first valve to selectively seal the first chamber from the second chamber when closed and to permit transfer of the substrate through the first valve when open:
a third chamber coupled to the second chamber and having a mechanism to support the substrate therein, the mechanism movable between retracted and extended positions;
a second valve to selectively seal the second chamber from the third chamber when closed and to permit transfer of the substrate through the second valve when open;
a second load lock chamber;
a second load lock valve to selectively seal the second load lock chamber from the third chamber when closed and to permit transfer of the substrate through the second load lock valve when open;
two substrate transfer shuttles, each moveable along a linear path which extends at least between one position in the first load lock chamber and another position in the second load lock chamber to transfer the substrate between the first load lock chamber, the first chamber, the second chamber, the third chamber, and the second load lock chamber, one of the substrate transfer shuttles to transfer substrates between the first load lock chamber, the first chamber and the second chamber, the other of the substrate transfer shuttles to transfer substrates between the second chamber, the third chamber and the second load lock chamber, said substrate transfer shuttles configured and arranged so that when in a selected one of the chambers, the substrate may be removed from the substrate transfer shuttle by moving the support mechanism from the retracted position to the extended position after which the substrate transfer shuttle may be removed from the selected one of the chambers.

7 more elements

Dependencies are inferred from the claim text.

Description8,072 words

Summary1,494 words

#The invention relates to substrate processing, and more particularly to transferring substrates to and from processing chambers.

#Glass substrates are being used for applications such as active matrix televisions and computer displays, among others. A large glass substrate can form multiple display monitors, each of which may contain more than a million thin film transistors.

#The processing of large glass substrates often involves the performance of multiple sequential steps, including, for example, the performance of chemical vapor deposition (CVD) processes, physical vapor deposition (PVD) processes, or etch processes. Systems for processing glass substrates can include one or more process chambers for performing those processes.

Brief description of the drawings12 figures

#FIG. 1 is a top plan schematic view of a processing island of a system according to the present invention.

#FIG. 1A is a side schematic view of a section of a load lock emplying alcoves.

#FIGS. 2A-2C are top plan views of a shuttle and lifting fork according to the present invention.

Detailed description6,318 words

#Like reference numbers and designations in the various drawings indicate like elements.

#FIG. 1 shows a processing island 42 of a fabrication system according to an embodiment of the present invention. Arrow 101 defines a direction pointing from “upstream” to “downstream” in the processing island. The island 42 includes a substrate heating load lock chamber 50 at a first end of the island and a substrate cooling load lock chamber 52 at a second end of the island, longitudinally opposite and downstream of the first end. Of course, the terms “heating” and “cooling” are not intended to be limiting. Rather, they are descriptive of exemplary features such chambers may possess.

#Between the load lock chambers 50 and 52 are a plurality of processing chambers 54A-54C, which are connected in series between the load lock chambers. Each processing chamber 54A-54C includes first and second gate valves 56A-56C and 58A-58C, respectively, at the first and second ends of each processing chamber (see also FIG. 3). The valve 56A selectively seals the load lock chamber 50 from the processing chamber 54A when closed and permits transfer of substrates through the valve between the load lock chamber 50 and the processing chamber 54A when open. Similarly, the valve 58C selectively seals the load lock chamber 52 from the processing chamber 54C in a closed condition and permits the transfer of substrates through the valve in an open condition. The valves 58A and 56B seal the first processing chamber 54A from the second processing chamber 54B when closed and permit the transfer of substrates through the valves when open. Likewise, the valves 58 and 56C selectively seal the second processing chamber 54B from the third processing chamber 54C in closed conditions and permit the transfer of substrates through the valves in open conditions. The pairs of valves 58A, 56B and 58B, 56C may be replaced with single valves although the illustrated configuration has advantages described below. An example of the type of valve which may be employed is described in above-mentioned U.S. patent application entitled “Isolation Valves”, [attorney docket number 2157 (226001)] filed on even date herewith, and incorporated by reference above.

Facts

Application

09/881,009Filed 13 Jun 2001

Priority

20 May 1998

Published

9 Oct 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification20 codes

H10P 72/3306
Into and out of processing chamber: horizontal transfer of a single workpiece
C03B 25/08
With horizontal displacement of the glass products: of glass sheets
C03B 29/08
With horizontal displacement of the products: glass sheets
C03B 35/142
Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands: by travelling transporting tables

Substrate transfer shuttle

Life of this patent

Substrate transfer shuttle

Life of this patent

Life of this patent

Abstract

Drawings

Drawings

Claims59

Description8,072 words

Drawings

Classification20 codes

Life of this patent

Description8,072 words