Multichannel optical communications module

Abstract

250 μm is the standardized pitch H of the prevalent multichannel ribbonfibers. Current laser diodes and photodiodes have a size larger than 300 μm. Curving lightpaths made on a silicon bench for reconciling the chip size with current ribbonfibers causes bending power loss, optical crosstalk and difficulty of production. Linear parallel lightpaths with a width d for more than one chip site are produced on a bench with a pitch E which is equal to the pitch H of the multichannels. Optoelectronic device chips with a width W satisfying an inequality E<W<2E−d are mounted on the lightpaths at spots which are different from neighboring chips in the longitudinal direction.

Dependencies are inferred from the claim text.