Optical waveguide platform and manufacturing method thereof
AssigneeElectronics and Telecommunications Research Institute
InventorsJang-uk Shin, Duk-jun Kim, Sang-ho Park, Young-tak Han, Hee-keyng Sung
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AssigneeElectronics and Telecommunications Research Institute
InventorsJang-uk Shin, Duk-jun Kim, Sang-ho Park, Young-tak Han, Hee-keyng Sung
Estimating the term…
An optical waveguide platform and a manufacturing method thereof are provided. In the provided optical waveguide platform, a terrace on which an optical device is mounted is formed by using an etch stopper pattern formed on a lower clad layer. Therefore, the optical device is mounted without processing a silicon substrate. In addition, in the provided optical waveguide platform, the etch stopper pattern is formed on the lower clad layer to prevent defocus in a photolithography process due to an etch step, so as not to damage a fine waveguide pattern. Moreover, an optical waveguide is formed on the terrace in manufacturing the optical waveguide platform to examine the characteristics of the optical waveguide device before etching a trench.
An optical waveguide platform, comprising:
A method of manufacturing an optical waveguide platform comprising the acts of:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
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Of the integrated circuit kind: combinations of two or more optical elements
Integrated optical circuits characterised by the manufacturing method: by etching
Coupling light guides: coupling light guides with opto-electronic elements
Optical elements, systems or apparatus
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This application claims the priority of Korean Patent Application No. 2002-17599, filed Mar. 30, 2002 in the Korean Intellectual Property Office, which is incorporated herein in its entirety by reference.
1. Field of the Invention
The present invention relates to a planar optical waveguide-type optical transceiver module and a manufacturing method thereof, and more particularly, to an optical waveguide platform for mounting an optical device by a flip chip bonding method and a manufacturing method thereof.
The above objective and advantages of the present invention will become more apparent by describing in detail a preferred embodiment thereof with reference to the attached drawings in which:
FIGS. 1A through 1G are sectional views illustrating a first conventional method of manufacturing an optical waveguide platform;
FIGS. 2A through 2G are sectional views illustrating a second conventional method of manufacturing an optical waveguide platform; and
The present invention will now be described more fully with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness of layers and regions are exaggerated for clarity. It will also be understood that when a layer is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present.
An optical waveguide platform according to an embodiment of the present invention will now be described with reference to FIG. 3G.
An optical waveguide platform according to the present invention is formed of a substrate 100, for example, a silicon substrate, and a lower clad layer 102 is formed thereon. A terrace 114 is formed on a predetermined portion of the lower clad layer 102 to mount an optical device 118. An etch stopper pattern 104 is formed on the terrace 114. In this case, the etch stopper pattern 104 is formed of a chrome oxide layer.