Pattern forming method
AssigneeKabushiki Kaisha Toshiba
InventorsAtsushi Ando, Kazuyoshi Sugihara, Katsuya Okumura, Tetsuro Nakasugi
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AssigneeKabushiki Kaisha Toshiba
InventorsAtsushi Ando, Kazuyoshi Sugihara, Katsuya Okumura, Tetsuro Nakasugi
Estimating the term…
To achieve down-sizing and improvements of throughputs, light exposure and charge beam exposure are sometimes used together. In case of performing exposure of a desired pattern in a plurality of stages, a positional displacement of each of exposure patterns in the stages leads to a decrease in exposure accuracy. According to the present invention, in case of forming a fine pattern by exposure after exposure of a rough pattern, the exposure position of the rough pattern is adjusted, based on a latent image of the rough pattern which has been subjected to exposure. As a result, a positional-displacement between rough and fine patterns is reduced so that a desired pattern can be formed with high accuracy.
A pattern forming method of forming a desired pattern on a sensitive material coated on a substrate, comprising:
A pattern forming method for forming a desired pattern in a sensitive material formed on a substrate, comprising:
An exposure apparatus for forming a desired pattern by exposing a sensitive material coated on a substrate, comprising:
An exposure apparatus comprising:
A lithography system comprising:
A lithography system comprising:
A pattern inspection method characterized in that an exposure pattern is subjected to inspection by detecting a latent image in an exposed sensitive material before development after a desired pattern is transferred by exposing the sensitive material coated on a substrate.
A pattern inspection apparatus for inspecting a pattern transferred by exposing a sensitive material on a substrate, comprising:
Dependencies are inferred from the claim text.