Multi-layer-substrate and satellite broadcast reception apparatus

A satellite broadcast reception apparatus comprising a multilayer substrate provided with a microstrip line and including more than two pattern layers sandwiching a dielectric layer, the apparatus receiving an electric wave signal from an antenna, passing the signal through a waveguide and transmitting the signal via a probe to said microstrip line, wherein:

• said microstrip line is formed at one surface layer's pattern a second layer's pattern cooperating with said one surface layer's pattern to sandwich a dielectric layer underlying said one surface layer's pattern and said probe is inserted from said one surface layer's pattern into a probe hole extending in a direction intersecting said multilayer substrate to pass said probe;
• and
• in at least one dielectric layer overlying a pattern layer other than said first and second, pattern layers at least a region surrounding said probe hole is a dielectric free region provided by removing a predetermined region surrounding said probe hole.

A satellite broadcast reception apparatus comprising a multilayer substrate provided with a microstrip line and including four, microstrip's pattern layers sandwiching a dielectric layer, the apparatus receiving an electric wave signal from an antenna, passing the signal through a waveguide and transmitting the signal via a probe to said microstrip line, wherein:

• said microstrip line is formed at one surface layer's pattern a second layer's pattern cooperating with said one surface layer's pattern to sandwich a dielectric layer underlying said one surface layer's pattern and said probe is inserted from said one surface layer's pattern into a probe hole extending in a direction intersecting said multilayer substrate to pass said probe;
• and
• at least one of said third and fourth layer has a pattern with a ground pattern surrounding said probe and isolated by an inner isolation band corresponding to a pattern free portion in a band surrounding a throughhole land passing said probe and by an outer isolation band corresponding to a pattern free portion in a band located outer than said inner isolation band and surrounding said ground pattern, the isolated ground pattern having conduction with respect to another layer through a throughhole extending through the ground pattern for conduction.

A multilayer substrate provided with a microstrip line, having more than two pattern layers with a dielectric layer posed therebetween, and provided with a probe hole passing a probe therethrough, wherein:

• said microstrip line is provided at one surface layer's pattern and a second layer's pattern cooperating with said one surface layer's pattern to sandwich a dielectric layer;
• and
• in at least one pattern layer other than said first and second, pattern layers at least a region surrounding said probe hole is one of a pattern free region provided by removing a predetermined region surrounding said probe hole and an isolated region corresponding to a predetermined region surrounding said probe hole and further electrically isolated from an outer, surrounding region of said at least one pattern layer.

A multilayer substrate provided with a microstrip line, having more than two pattern layers with a dielectric layer posed therebetween, and provided with a probe hole passing a probe therethrough, wherein:

• said microstrip line is provided at one surface layer's pattern and a second layer's pattern cooperating with said one surface layer's pattern to sandwich a dielectric layer;
• and
• in at least one dielectric layer overlying a pattern layer other than said first and second, pattern layers at least a region surrounding said probe hole is a dielectric free region provided by removing a predetermined region surrounding said probe hole.

A multilayer substrate provided with a microstrip line, having four, microstrip's pattern layers with a dielectric layer posed therebetween, and provided with a probe hole passing a probe therethrough, wherein:

• said microstrip line is provided at one surface layer's pattern and a second layer's pattern cooperating with said one surface layer's pattern to sandwich a dielectric layer;
• and
• at least one of said third and fourth layer has a pattern with a ground pattern surrounding said probe and isolated by an inner isolation band corresponding to a pattern free portion in a band surrounding a throughhole land passing said probe and by an outer isolation band corresponding to a pattern free portion in a band located outer than said inner isolation band and surrounding said ground pattern, the isolated ground pattern having conduction with respect to another layer through a throughhole extending through the ground pattern for conduction.