Semiconductor module
AssigneeMitsubishi Denki Kabushiki Kaisha and Mitsubishi Electric Engineering Company Limited
InventorsSeiji Sawada, Hiroyuki Nakao, Tatsuji Kobayashi
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Abstract
A semiconductor module is provided with a module substrate, a plurality of semiconductor chips formed on the module substrate, and a mold resin formed so as to integrally cover the plurality of semiconductor chips. Then, a plurality of trenches is formed on the main surface of the module substrate, so as to be parallel to one side forming the main surface, on the side on which the bare chips are formed. Thereby, a semiconductor module can be obtained wherein it is possible to restrict separation of the mold resin from the module substrate.
Claims13
A semiconductor module comprising:
- a module substrate wherein a trench or a mesa is formed on a main surface;
- a plurality of bare chips mounted on the main surface of the module substrate;
- and
- a mold resin that integrally covers the plurality of bare chips and that is formed so as to be adhered to said trench or said mesa.
The semiconductor module, comprising:
- a module substrate;
- a plurality of bare chips mounted on a main surface of the module substrate;
- and
- a mold resin formed so as to integrally cover the plurality of bare chips, wherein
- said module substrate has an engaging member that is secured to said main surface and that engages said mold resin, thereby said module substrate and said mold resin are restricted from separating from each other.
A semiconductor module comprising:
- a module substrate;
- a plurality of bare chips mounted on a main surface of the module substrate;
- and
- a mold resin formed so as to integrally cover the plurality of bare chips, wherein
- said module substrate has a plurality of securing parts that is provided, in order to secure said plurality of bare chips to said module substrate, respectively, between the module substrate and said plurality of bare chips, that protrudes from the main surface of said module substrate and that has sizes no greater than the respective main surfaces of said plurality of bare chips.
A semiconductor module comprising:
- a module substrate;
- a plurality of bare chips mounted on a main surface of the module substrate;
- and
- a mold resin formed so as to integrally cover the plurality of bare chips, wherein
- said mold resin is formed so as to extend to a main surface of the rear side of said main surface.
A semiconductor module comprising:
- a module substrate;
- a plurality of bare chips mounted on a main surface of the module substrate;
- and
- a mold resin formed so as to integrally cover the plurality of bare chips and having an irregularity on the main surface.
Dependencies are inferred from the claim text.