Method and apparatus for attaching microelectronic substrates and support members

A method for forming a microelectronic package, comprising:

• forming an attachment structure by disposing a first quantity of material on at least one of a microelectronic substrate and a support member while the first quantity of material is at least partially flowable;
• at least partially reducing a flowability of the first quantity of material;
• applying a second quantity of material to the attachment structure after at least partially reducing the flowability of the first quantity of material;
• connecting the attachment structure to the other of the microelectronic substrate and the support member, the attachment structure providing no electrically conductive link between the microelectronic substrate and the support member;
• and
• electrically connecting the microelectronic substrate and the support member.

A method for forming a microelectronic package, comprising:

• forming an attachment structure by disposing a first quantity of material on a support member, the first quantity of material having a first composition;
• forming a first joint between the first quantity of material and the support member, the first joint having a first bond strength;
• applying a second quantity of material to first quantity of material, the second quantity of material having a second composition different than the first composition;
• forming a second joint between the second quantity of material and the microelectronic substrate, the second joint having a second bond strength, the second bond strength being greater than the first bond strength, wherein the attachment structure provides no electrically conductive link between the microelectronic substrate and the support member;
• and
• electrically connecting the microelectronic substrate and the support member.

A method for forming a microelectronic package, comprising:

• forming an attachment structure by disposing a first quantity of material on at least one of a first microelectronic substrate and a second microelectronic substrate while the first quantity of material is at least partially flowable;
• at least partially reducing a flowability of the first quantity of material;
• applying a second quantity of material to the first quantity of material while the second quantity of material is at least partially flowable and after at least partially reducing the flowability of the first quantity of material;
• connecting the attachment structure to the other of the first microelectronic substrate and the second microelectronic substrate, the attachment structure providing no electrically conductive link between the microelectronic substrate and the support member;
• and
• electrically connecting the first and second microelectronic substrates.

A method for forming a microelectronic package, comprising:

• forming an attachment structure depending from at least one of a microelectronic substrate and a support member by disposing at least a first quantity of material on the at least one of the microelectronic substrate and the support member while the first quantity of material is at least partially flowable, the attachment structure projecting from the at least one of the microelectronic substrate and the support member by a distance of about 35 microns or more;
• connecting the attachment structure to the other of the microelectronic substrate and the support member with the attachment structure providing no electrically conductive link between the microelectronic substrate and the support member;
• and
• electrically connecting the microelectronic substrate and the support member.

A method for forming a microelectronic package, comprising:

• providing a support member having a first side and a second side facing opposite from the first side, the support member having a slot extending through the support member from the first side to the second side, the slot having a first edge and a second edge;
• disposing a first volume of material on the first side of the support member along the first edge of the slot while the first volume is in an at least partially flowable state;
• disposing a second volume of material on the first side of the support member along the second edge of the slot while the second volume is in an at least partially flowable state;
• at least partially curing the first and second volumes of material;
• disposing a third volume of material on the first volume of material while the third volume is in an at least partially flowable state;
• disposing a fourth volume of material on the second volume of material while the fourth volume is in an at least partially flowable state;
• attaching a microelectronic substrate to the second and fourth volumes of material with the first, second, third and fourth volumes providing no conductive link between the microelectronic substrate and the support member;
• and
• connecting conductive members between the microelectronic substrate and the support member with the conductive members extending through the slot.

A method for forming a microelectronic package, comprising:

• providing a support member having a first surface, a second surface facing opposite from the first surface, and an aperture extending through the support member from the first surface to the second surface;
• forming an attachment structure by applying a quantity of adhesive material to at least one of the support member and a microelectronic substrate while the adhesive material is at least partially flowable;
• connecting the adhesive material to the other of the microelectronic substrate and the support member with the attachment structure providing no electrically conductive link between the microelectronic substrate and the support member, and with the attachment structure being recessed outwardly from an edge of the aperture;
• and
• electrically connecting the microelectronic substrate and the support member.

A microelectronic package, comprising:

• a support member having a first surface, a second surface facing opposite from the first surface, and a projection extending away from the first surface;
• a microelectronic substrate having a surface facing toward the first surface of the support member;
• a quantity of adhesive material disposed on the projection, the adhesive material and the projection forming an attachment structure, the attachment structure being disposed between the microelectronic substrate and the support member and being attached to at least one of the microelectronic substrate and the support member, the attachment structure forming no electrically conductive link between the microelectronic substrate and the support member;
• and
• a conductive coupler between the microelectronic substrate and the support member.

A microelectronic package, comprising:

• a support member having a first surface, a second surface facing opposite the first surface;
• an attachment structure that includes a projection extending away from the first surface, the attachment structure further including a quantity of adhesive material applied to the projection while the adhesive material is at least partially flowable;
• a microelectronic substrate connected to the attachment structure with a surface of the microelectronic substrate facing toward the first surface of the support member and with the attachment structure providing no electrically conductive link between the microelectronic substrate and the support member;
• and
• a conductive link between the microelectronic substrate and the support member.

A microelectronic package, comprising:

• a support member;
• a microelectronic substrate positioned at least proximate to the support member;
• an attachment structure having a first quantity of material disposed on at least one of the microelectronic substrate and the support member and a second quantity of material disposed on the first quantity of material, the attachment structure being positioned between the support member and the microelectronic substrate and being attached to at least one of the support member and the microelectronic substrate, the attachment structure forming no electrically conductive link between the support member and the microelectronic substrate;
• and
• a conductive coupler between the microelectronic substrate and the support member.

A microelectronic package, comprising:

• a support member;
• a microelectronic substrate positioned at least proximate to the support member;
• an attachment structure having a first quantity of material disposed on the support member and a second quantity of material disposed on the first quantity of material, the second quantity of material being attached to the microelectronic substrate, wherein the first quantity of material forms a first joint with the support member, the first joint having a first bond strength, and wherein the second quantity of material forms a second joint with the microelectronic substrate, the second joint having a second bond strength, and wherein the second bond strength is greater than the first bond strength, and wherein the attachment structure forms no electrically conductive link between the microelectronic substrate and the support member;
• and
• a conductive coupler between the microelectronic substrate and the support member.

A microelectronic package, comprising:

• a first microelectronic substrate;
• a second microelectronic substrate positioned at least proximate to the first microelectronic substrate;
• an attachment structure connected between the first and second microelectronic substrates, the attachment structure having a first quantity of material disposed on the first microelectronic substrate and a second quantity of material disposed on the first quantity of material, the attachment structure forming no electrically conductive link between the first and second microelectronic substrates;
• and
• a conductive coupler between the first and second microelectronic substrates.

A microelectronic package, comprising:

• a support member;
• a microelectronic substrate positioned proximate to the support member;
• and
• an attachment structure formed at least in part from an initially flowable adhesive material disposed in its flowable state proximate to at least one of the microelectronic substrate and the support member, the attachment member being attached to at least one of the microelectronic substrate and the support member and projecting away from the at least one of the microelectronic substrate and the support member by a distance of about 35 microns or more, the attachment structure providing no electrically conductive path between the microelectronic substrate and the support member.

A microelectronic package, comprising:

• a support member having a first side and a second side facing opposite from the first side, the support member having a slot extending through the support member from the first side to the second side, the slot having a first edge and a second edge;
• a first attachment structure disposed on the first side of the support member along the first edge of the slot, the first attachment structure having a first quantity of material disposed on the support member and a second quantity of material disposed on the first quantity of material after a flowability of the first quantity of material has been at least partially reduced from a first value to a second value;
• a second attachment structure disposed on the first side of the support member along the second edge of the slot, the second attachment structure having a third quantity of material disposed on the support member and a fourth quantity of material disposed on the third quantity of material after a flowability of the third quantity of material has been at least partially reduced from a first value to a second value;
• a microelectronic substrate attached to the first and second attachment structures with neither attachment structure providing an electrically conductive link between the microelectronic substrate and the support member;
• and
• a plurality of conductive couplers extending through the slot and connected to the microelectronic substrate and the support member.

A microelectronic package, comprising:

• a support member having an aperture with an aperture edge;
• a microelectronic substrate positioned proximate to the support member;
• and
• an attachment structure formed at least in part from an initially flowable adhesive material disposed in its flowable state proximate to at least one of the microelectronic substrate and the support member, the attachment structure being attached to at least one of the microelectronic substrate and the support member and being recessed outwardly away from the edge of the aperture, the attachment structure providing no electrically conductive path between the microelectronic substrate and the support member.