Under-bump-metallurgy layer

An under-ball-metallurgy layer over a contact pad, wherein the contact pad and corresponding contact surface of the under ball-metallurgy layer are both made from copper, the under-ball-metallurgy layer comprising:

• a first metallic layer over the contact pad, wherein the first metallic layer is fabricated using titanium;
• a second metallic layer over the first metallic layer, wherein the second metallic layer is fabricated using titanium-nitride compound;
• and
• a third metallic layer over the second metallic layer, wherein the third metallic layer is fabricated using gold, platinum, palladium, silver or copper.

An under-ball-metallurgy layer over a contact pad, wherein the contact pad and corresponding contact surface of the under-ball-metallurgy layer are both made from copper, the under-ball-metallurgy layer comprising:

• a first metallic layer over the contact pad, wherein the first metallic layer is fabricated using tantalum;
• a second metallic layer over the first metallic layer, wherein the second metallic layer is fabricated using tantalum-nitride compound;
• and
• a third metallic layer over the second metallic layer, wherein the third metallic layer is fabricated using gold, platinum, palladium, silver or copper.

An under-ball-metallurgy layer over a contact pad, wherein the contact pad and corresponding contact surface of the under-ball-metallurgy layer are both made from copper, the under-ball-metallurgy layer comprising:

• a first metallic layer over the contact pad, wherein the first metallic layer is fabricated using copper;
• a second metallic layer over the first metallic layer, wherein the second metallic layer is fabricated using chromium-copper alloy;
• and
• a third metallic layer over the second metallic layer, wherein the third metallic layer is fabricated using gold, platinum, palladium, silver or copper.

An under-ball-metallurgy layer over a contact pad, wherein the contact pad and corresponding contact surface of the under-ball-metallurgy layer are both made from copper, the under-ball-metallurgy layer comprising:

• a first metallic layer over the contact pad, wherein the first metallic layer is fabricated using tantalum;
• a second metallic layer over the first metallic layer, wherein the second metallic layer is fabricated using nickel-vanadium alloy;
• and
• a third metallic layer over the second metallic layer, wherein the third metallic layer is fabricated using gold, platinum, palladium, silver or copper.

An under-ball-metallurgy layer over a contact pad, wherein the contact pad and corresponding contact surface of the under-ball-metallurgy layer are both made from copper, the under-ball-metallurgy layer comprising:

• a first metallic layer over the contact pad, wherein the first metallic layer is fabricated using tantalum;
• a second metallic layer over the first metallic layer, wherein the second metallic layer is fabricated using nickel;
• and
• a third metallic layer over the second metallic layer, wherein the third metallic layer is fabricated using gold, platinum, palladium, silver or copper.

An under-ball-metallurgy layer over a contact pad, wherein the contact pad and corresponding contact surface of the under-ball-metallurgy layer are both made from copper, the under-ball-metallurgy layer comprising:

• a first metallic layer over the contact pad, wherein the first metallic layer is fabricated using copper;
• a second metallic layer over the first metallic layer, wherein the second metallic layer is fabricated using nickel-vanadium alloy;
• and
• a third metallic layer over the second metallic layer, wherein the third metallic layer is fabricated using gold, platinum, palladium, silver or copper.

An under-ball-metallurgy layer over a contact pad, wherein the contact pad and corresponding contact surface of the under-ball-metallurgy layer are both made from copper, the under-ball-metallurgy layer comprising:

• a first metallic layer over the contact pad, wherein the first metallic layer is fabricated using titanium;
• a second metallic layer over the first metallic layer, wherein the second metallic layer is fabricated using nickel;
• and
• a third metallic layer over the second metallic layer, wherein the third metallic layer is fabricated using gold, platinum, palladium, silver or copper.

An under-ball-metallurgy layer over a contact pad, wherein the contact pad and corresponding contact surface of the under-ball-metallurgy layer are both made from copper, the under-ball metallurgy layer comprising:

• a first metallic layer over the contact pad, wherein the first metallic layer is fabricated using chromium-copper alloy;
• a second metallic layer over the first metallic layer, wherein the second metallic layer is fabricated using chromium;
• a third metallic layer over the second metallic layer, wherein the third metallic layer is fabricated using chromium-copper alloy;
• and
• a fourth metallic layer over the third metallic layer, wherein the fourth metallic layer is fabricated using gold, platinum, palladium, silver or copper.