Flip-chip bonding structure and method thereof
OwnerHo-Ming Tong, Chun-Chi Lee +4inventors
InventorsHO-MING TONG, CHUN-CHI LEE, JEN-KUANG FANG, MIN-LUNG HUANG, CHING-HUEI SU, CHAO-FU WENG
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Abstract
A flip-chip bonding structure suited for bonding a first connect pad and a second connect pad. The flip-chip bonding structure includes a metal layer, a bump and an adhesion body. The metal layer is placed on the first connect pad. The bump, lead-free material, is placed on the metal layer. The adhesion body, made of lead-free material, is placed on the bump and is bonded onto the second connect pad.
Claims25
A flip-chip bonding structure suited for bonding a first connect pad and a second connect pad, the structure comprising:
- a metal layer placed on the first connect pad;
- a lead-free bump placed on the metal layer;
- and
- a lead-free adhesion body placed on the lead-free bump and bonded onto the second connect pad.
A flip-chip connection structure, comprising:
- a connect pad;
- a metal layer placed on the connect pad;
- and
- a lead-free bump placed on the metal layer.
A flip-chip connection process suited for connecting a first connect pad and a second connect pad, the process comprising the steps of:
- forming a metal layer on the first connect pad;
- forming a lead-free bump on the metal layer;
- forming a lead-free pre-adhesion body on the second connect pad;
- and
- connecting the lead-free bump with the lead-free pre-adhesion body.
Dependencies are inferred from the claim text.