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US 2003/0189257 A1Published application
Multi-chip module and methods
AssigneeMicron Technology, Inc.
InventorsDavid J. Corisis, Jerry M. Brooks, Matt E. Schwab
Life of this patent
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AssigneeMicron Technology, Inc.
InventorsDavid J. Corisis, Jerry M. Brooks, Matt E. Schwab
Estimating the term…
A substrate includes first and second regions over which first and second semiconductor devices are to be respectively positioned. The first region is located at least partially within the second region. Contact areas are located external to the first region, but within the second region. In one embodiment, in which semiconductor devices are to stacked over and secured to the substrate in a flip-chip type arrangement, the contact areas correspond to bond pads of an upper, second semiconductor device, while other contact areas located within the first region corresponding to bond pads of a lower, first semiconductor device. In another embodiment, the contact pads correspond to bond pads of the first semiconductor device, which are electrically connected thereto by way of laterally extending discrete conductive elements, while other contact pads that are located external to the second region correspond to bond pads of the upper, second semiconductor device.
A multi-chip module, comprising:
A substrate for use in a multi-chip module including at least first and second semiconductor devices in stacked arrangement, comprising:
A method for designing a substrate for use in a multi-chip module that includes semiconductor devices in stacked arrangement, comprising:
A method for forming a multi-chip module, comprising:
Dependencies are inferred from the claim text.