Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, stacked chip assemblies including the rerouted semiconductor devices, and methods

A method for designing a rerouting element for use with a semiconductor device including at least one bond pad positioned substantially centrally on a surface thereof, comprising:

• configuring at least one contact location on a first surface of a substantially planar member, said at least one contact location mirroring a position of the at least one bond pad on the surface of the semiconductor device;
• configuring at least one conductive trace location extending from said at least one contact location toward a periphery of said substantially planar member;
• and
• configuring at least one rerouted bond pad location proximate said periphery, said at least one rerouted bond pad position being configured to be exposed beyond a periphery of another semiconductor device upon positioning the other semiconductor device over the surface of the semiconductor device.

A rerouting element for use with a semiconductor device, comprising:

• a base substrate;
• a plurality of conductive vias positioned adjacent at least two peripheral edges of said base substrate, each conductive via of said plurality of conductive vias being located so as to align with a corresponding, peripherally located bond pad of the semiconductor device upon assembly of said rerouting element with the semiconductor device;
• a plurality of conductive traces;
• and
• a plurality of contact pads, each conductive trace of said plurality of conductive traces extending from a corresponding conductive via toward at least one other peripheral edge of said base substrate to a corresponding contact pad of said plurality of contact pads.

A rerouting element for use with a semiconductor device, comprising:

• a base substrate;
• a plurality of conductive vias, at least some of which are positioned centrally on said base substrate, each conductive via of said plurality of conductive vias being located so as to align with a corresponding bond pad of the semiconductor device upon assembly of said rerouting element with the semiconductor device;
• a plurality of conductive traces;
• and
• a plurality of contact pads, each conductive trace of said plurality of conductive traces extending from a corresponding conductive via toward at least one peripheral edge of said base substrate to a corresponding contact pad of said plurality of contact pads.