Physically deposited layer to electrically connect circuit edit connection targets
AssigneeIntel Corporation
InventorIlan Gavish
Life of this patent
Estimating the term…
Abstract
Disclosed is a layer to electrically connect targets during a circuit edit of an integrated circuit and systems and methods for forming the layer. The layer contains a conductive material, such as gold or another metal, which has been physically deposited by sputtering, thermal evaporation, and other physical deposition technique.
Claims29
An integrated circuit comprising:
- a first circuit edit connection target;
- a second circuit edit connection target;
- and
- a layer containing a physically deposited electrically conductive material that is coupled with the first target, coupled with the second target, and disposed between the first target and the second target to electrically connect the first target with the second target.
An integrated circuit comprising:
- a first connection target;
- a second connection target;
- and
- means for electrically connecting the first target with the second target.
A method comprising connecting a first exposed circuit edit connection target with a second exposed circuit edit connection target by physically depositing a metal containing no significant amount of carbon over the first target over the second target and between the first target and the second target.
A method comprising:
- exposing a first circuit edit connection target and a second circuit edit connection target by removing a portion of an integrated circuit over the targets;
- and
- electrically connecting the exposed targets by physically depositing a conductive material over the first target, over the second target, and between the first target and the second target.
A method for debugging an integrated circuit comprising:
- detecting a first bug associated with a missing connection between a first circuit edit connection target and a second circuit edit connection target;
- exposing the first circuit edit connection target and the second circuit edit connection target by removing a portion of an integrated circuit over the targets;
- and
- electrically connecting the exposed targets by physically depositing a conductive material over the first target, over the second target, and between the first target and the second target;
- and
- detecting a second bug in the same integrated circuit after said electrically connecting the exposed targets.
Dependencies are inferred from the claim text.