Chip structure and wire bonding process suited for the same
OwnerHo-Ming Tong, Chun-Chi Lee +4inventors
InventorsHo-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su, Chao-Fu Weng
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Abstract
A chip structure having a chip, an adhesion layer, and a metal layer. The chip has an active surface and many conductive pads. The conductive pads are disposed on the active surface, wherein the conductive pads are made of copper. The adhesion layer is directly formed on the conductive pads, wherein the material of the adhesion layer includes copper. The metal layer is formed on the adhesion layer, wherein the material of the metal layer includes copper.
Claims33
A chip structure, suited for being connected with a plurality of conductive wires, comprising:
- a chip having an active surface and a plurality of conductive pads located on the active surface of the chip;
- an adhesion layer formed on the conductive pads;
- and
- a metal layer located on the adhesion layer and connected with the conductive wires.
A chip structure, suited for being connected with a plurality of conductive wires, comprising:
- a chip having an active surface and a plurality of conductive pads located on the active surface of the chip;
- and
- a metal protection layer located on the conductive pads and connected with the conductive wires.
A structure for connecting a conductive wire and an electrical connection, comprising:
- an electrical connection;
- a metal protection layer formed on the electrical connection;
- and
- a conductive wire coupled to the metal protection layer.
A wire-bonding process, comprising:
- providing a chip with an active surface and at least one conductive pad located on the active surface;
- forming an adhesion layer on the active surface and the conductive pad of the chip;
- forming a photoresist layer on the adhesion layer, wherein the photoresist layer has at least one opening exposing the adhesion layer positioned on the conductive pad;
- forming a metal layer in the opening of the photoresist layer and the metal layer formed on the adhesion layer;
- removing the photoresist layer;
- removing the adhesion layer exposed to the outside;
- and
- coupling one end of a conductive wire to the metal layer positioned over the conductive pad.
Awire-bonding process, comprising:
- providing a chip with an active surface and at least one conductive pad located on the active surface;
- forming an adhesion layer on the active surface and the conductive pad of the chip;
- forming a metal layer on the adhesion layer;
- forming a photoresist layer on the metal layer, wherein the photoresist layer has at least one opening exposing the metal layer not positioned over the conductive pad;
- removing the metal layer exposed to the outside;
- removing the adhesion layer exposed to the outside;
- removing the photoresist layer;
- and
- coupling one end of a conductive wire to the metal layer positioned over the conductive pad.
A wire-bonding process, comprising:
- providing an electrical connection;
- forming a metal protection layer on the electrical connection;
- and
- coupling one end of the conductive wires to the metal layer.
Dependencies are inferred from the claim text.