Flip chip assembly and method for producing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorJen Kuang Fang
Life of this patent
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Abstract
A flip chip assembly comprises an IC chip having a plurality of first solder bumps formed on a lower surface thereof and a heat sink having a plurality of second solder bumps, wherein the heat sink are attached to an upper surface of the IC chip via the second solder bumps. The present invention further provides a method for producing the flip chip assembly.
Claims15
A flip chip assembly comprising:
- an IC chip having a plurality of first solder bumps formed on a lower surface thereof;
- and
- a heat sink having a plurality of second solder bumps,
- wherein the heat sink are attached to an upper surface of the IC chip via the second solder bumps.
A method for producing a flip chip assembly comprising the following steps:
- providing an IC chip having a plurality of first solder bumps formed on a lower surface thereof;
- providing a heat sink having a plurality of second solder bumps formed thereon;
- placing the heat sink on the IC chip;
- and
- reflowing the second solder bumps so as to attach the heat sink to the IC chip.
A method of forming a flip chip package attached on a substrate provided with a plurality of contact pads, the method comprising the following steps:
- providing an IC chip having a plurality of first solder bumps on a lower surface thereof;
- providing a heat sink having a plurality of second solder bumps formed thereon;
- placing the IC chip on the substrate such that the first solder bumps of the IC chip is aligned with the contact pads of the substrate;
- placing the heat sink on the IC chip;
- and
- reflowing the first and second solder bumps so as to securely attach the IC chip to the substrate and securely attach the heat sink to the IC chip at the same time.
Dependencies are inferred from the claim text.