Microelectronic package with reduced underfill and methods for forming such packages

A microelectronic package, comprising:

• a support member having an interior surface, a first terminal at least proximate to the interior surface, and an exterior surface facing opposite from the interior surface;
• a microelectronic substrate positioned proximate to the support member with an intermediate region positioned between the support member and the microelectronic substrate, the microelectronic substrate having a first surface with a first surface area facing toward the interior surface of the support member, a second terminal at least proximate to the first surface, and a second surface facing opposite from the first surface,
• at least one conductive coupler positioned in the intermediate region and coupled between the first and second terminals;
• and
• a generally electrically non-conductive material disposed in the intermediate region, the material being in contact with the interior surface of the support member and the first surface of the microelectronic substrate, the material having a contact surface adjacent to the first surface of the microelectronic substrate, the contact surface having a second surface area, the second surface area being smaller than the first surface area.

A packaged microelectronic device, comprising:

• a support member having a first terminal, an interior surface, and an exterior surface facing opposite from the interior surface, the interior surface having a die attach site;
• a generally non-conductive fill material disposed at the die attach site while in a flowable state, the fill material covering a first surface area of the interior surface of the support member;
• a microelectronic substrate having an integrated circuit, a second terminal, a first surface facing toward the die attach site at the interior surface of the support member, and a second surface facing opposite from the first surface, the first surface of the microelectronic substrate having a second surface area greater than the first surface area of the support member, with at least a portion of the first surface of the microelectronic substrate contacting the fill material;
• and
• at least one conductive coupler coupled between the first and second terminals.

A microelectronic package, comprising:

• a support member having an interior surface, a plurality of first terminals at least proximate to the interior surface, and an exterior surface facing opposite from the interior surface;
• a microelectronic substrate positioned at least proximate to the support member, the microelectronic substrate having a first surface, a plurality of second terminals at least proximate to the first surface, and a second surface facing opposite from the first surface, the first surface of the microelectronic substrate having an outer edge and facing toward the interior surface of the support member with at least a portion of the first surface of the microelectronic substrate being spaced apart from the interior surface of the support member to define an intermediate region;
• a plurality of conductive couplers positioned in the intermediate region and connected between the first and second terminals;
• a generally electrically non-conductive first material disposed in the intermediate region, the first material contacting the first surface of the microelectronic substrate only inwardly from the outer edge;
• and
• an encapsulating second material disposed adjacent to at least one of the microelectronic substrate, the support member and the first material.

A microelectronic device package, comprising:

• a support member having an interior surface, a first terminal at least proximate to the interior surface, and an exterior surface facing opposite from the interior surface;
• a microelectronic substrate positioned at least proximate to the support member, the microelectronic substrate having a first surface, a second terminal at least proximate to the first surface, a second surface facing opposite from the first surface, and a third surface extending between the first and second surfaces, wherein the first surface of the microelectronic substrate faces toward the interior surface of the support member with at least a portion of the first surface being spaced apart from the interior surface of the support member to define an intermediate region;
• at least one conductive coupler positioned in the intermediate region and connected between the first and second terminals;
• and
• a generally electrically non-conductive material positioned in the intermediate region, the material contacting the interior surface of the support member and the first surface of the microelectronic substrate and being spaced apart from the third surface of the microelectronic substrate.

A method for forming a microelectronic package, comprising:

• positioning a microelectronic substrate proximate to a support member, wherein the microelectronic substrate has a first surface with an outer edge, and a second surface facing opposite from the first surface, the first surface facing toward an interior surface of the support member;
• contacting a generally non-conductive material with at least one of the interior surface of the support member and the first surface of the microelectronic substrate;
• contacting the material with the other of the interior surface of the support member and the first surface of the microelectronic substrate, wherein an outer surface of the material is recessed inwardly from the outer edge of the microelectronic substrate;
• and
• connecting at least one conductive coupler between a first terminal at least proximate to the first surface of the microelectronic substrate and a second terminal at least proximate to the interior surface of the support member.

A method for forming a microelectronic package, comprising:

• positioning a microelectronic substrate proximate to a support member, wherein the microelectronic substrate has a first surface with an outer edge, and a second surface facing opposite from the first surface, the first surface facing toward an interior surface of the support member;
• contacting a generally non-conductive material with at least one of the interior surface of the support member and the first surface of the microelectronic substrate while the generally non-conductive material is in a flowable state;
• contacting the material with the other of the interior surface of the support member and the first surface of the microelectronic substrate, wherein an outer surface of the material is recessed inwardly from the outer edge of the microelectronic substrate;
• connecting at least one conductive coupler between a first terminal of the microelectronic substrate and a second terminal of the support member.

A method for forming a microelectronic package, comprising:

• positioning a microelectronic substrate proximate to a support member, wherein the microelectronic substrate has a first surface facing toward an interior surface of the support member, a second surface facing opposite from the first surface and a third surface extending around a periphery of the microelectronic substrate between the first and second surfaces;
• contacting a generally non-conductive first material with at least one of the interior surface of the support member and the first surface of the microelectronic substrate;
• contacting the first material with the other of the interior surface of the support member and the first surface of the microelectronic substrate such that an outer surface of the first material is recessed inwardly from an outer edge of the first surface, and the first material does not contact the third surface of the microelectronic substrate;
• connecting a plurality of conductive couplers between first terminals at least proximate to the first surface of the microelectronic substrate and second terminals at least proximate to the interior surface of the support member;
• and
• disposing an encapsulating second material adjacent to the microelectronic substrate, the support member and the first material.