Surface-mountable light-emitting diode structural element
AssigneeOsram Opto Semiconductors GmbH & Co. OHG
InventorKarlheinz Arndt
Life of this patent
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Abstract
A surface-mountable light emitting diode structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame, is described. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electrically conductively connected with an electrical contact of the optoelectronic chip. The chip carrier part presents a number of external connections for improved conduction of heat away from the chip. The external connections project from a casing and at a distance from each other.
Claims20
An optoelectronic surface-mountable structural element comprising:
- a lead frame having a chip carrier part, at least three external connections, and a connection part disposed at a distance from said chip carrier part;
- an optoelectronic chip heat-conductively connected to said chip carrier part of said lead frame, said optoelectronic chip having an electrical contact electrically conductively connected to said connection part;
- and
- a casing encasing said chip carrier part, said connection part and said three external connections, said casing having a first main surface, a second main surface disposed opposite said first main surface and side surfaces, within said casing said at least three external connections as seen in a top view of said lead frame starting from said chip carrier part run toward an outside of said casing separately from each other and project from said casing on at least two sides of said casing at different places at a distance from each other, and outside said casing said at least three external connections configured so that said at least three external connections all simultaneously lie on one of a connection and a lead plate in an assembled state of the optoelectronic surface-mountable structural element provided for mounting the optoelectronic surface-mountable structural element.
An optoelectronic surface-mountable structural element, comprising:
- a lead frame having a chip carrier part, first external connections, and a first and second connection part with second external connections disposed at a distance from said chip carrier part, at least two of said first external connections being thermally conductively connected to said chip carrier part;
- a first and a second optoelectronic chip heat-conductively connected to said chip carrier part of said lead frame, said first optoelectronic chip having an electrical contact electrically conductively connected to said first connection part, and said second optoelectronic chip having an electrical contact electrically conductively connected to said second connection part;
- and
- a casing encasing said first optoelectronic chip, said second optoelectronic chip, and a part of said lead frame;
- said casing having a first main surface and an outwardly facing second main surface disposed opposite said first main surface;
- said first external connections, said first connection part, and said second connection part projecting outside of said casing;
- said first external connections thermally conductively connected to said chip carrier part and said second external connections of said first and second connection parts, as seen from a top view of said lead frame, project sideways from said casing, and disposed in a substantially stellate form within said casing.
Dependencies are inferred from the claim text.