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US 2003/0189213 A1Published application
Package for optical semiconductor
AssigneeCanon Kabushiki Kaisha
InventorsMasahiko Igaki, Makoto Ogura, Akio Atsuta, Tadashi Kosaka
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Abstract
To provide a package for an optical semiconductor having a light-emitting device and a light-receiving device in one package, in which a groove is provided between the light-emitting device and the light-receiving device to thereby avoid rays of light from the light-emitting device to directly enter the light-receiving device.
Claims6
A package for an optical semiconductor comprising:
- a wiring board on which a light-emitting device and a light-receiving device are mounted;
- and
- a surrounding member layer made of a resin material having a light transmittance property so as to cover outer surfaces of the light-emitting device and the light-receiving device,
- wherein a groove is provided for the surrounding member layer between the light-emitting device and the light-receiving device.
1 more element
Dependencies are inferred from the claim text.