Method of manufacturing thin film transistor
AssigneeHitachi, Ltd.
InventorsKazuhiko Horikoshi, Klyoshi Ogata, Takuo Tamura, Miwako Nakahara, Makoto Ohkura, Ryoji Oritsuki, Yasushi Nakano, Takeo Shiba
Life of this patent
Estimating the term…
Loading patent…
AssigneeHitachi, Ltd.
InventorsKazuhiko Horikoshi, Klyoshi Ogata, Takuo Tamura, Miwako Nakahara, Makoto Ohkura, Ryoji Oritsuki, Yasushi Nakano, Takeo Shiba
Estimating the term…
Inexpensive, unannealed glass is used as a substrate. The surface of a polycrystalline silicon film doped with boron (B) or phosphorus (P) is oxidized with ozone at a processing temperature of 500° C. or below to form a silicon oxide film of 4 to 20 nm thick on the surface of polycrystalline silicon. On account of this treatment, the level density at the interface between the gate-insulating layer and the channel layer can be made lower, and a thin-film transistor having less variations of characteristics can be formed on the unannealed glass substrate.
A process of manufacturing a thin-film transistor, comprising steps of:
A process of manufacturing a thin-film transistor, comprising steps of:
Dependencies are inferred from the claim text.